Inventors:
Alfred F. Tatyrek - Maplewood NJ
Merrill Eig - Encino CA
Assignee:
The United States of America as represented by the Secretary of the Army - Washington DC
International Classification:
B08B 308
Abstract:
A method was developed for the nondestructive removal of thermoset foamed potting material from the electronics package of components in ammunition. The ultimate objective in this effort was to perform a systems technical analysis of the electronic guidance and fuse systems. This was being done in order to determine the electronic components used, the engineering design, functional circuitry, and overall performance of the ammunition.
