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Scott Perzanoski Phones & Addresses

  • Woodstock, CT
  • 5 Prince Cir, Dudley, MA 01571 (508) 943-4937
  • 102 Mason Rd, Dudley, MA 01571 (508) 943-4862 (508) 943-4937
  • 5 Pine St, Dudley, MA 01571 (508) 943-4937
  • Webster, MA
  • Southwick, MA
  • Thompson, CT

Work

Company: Maxtor Jul 1994 to Dec 2000 Position: Senior pcb designer

Education

School / High School: Worcester Technical Institute 1989 to 1991 Specialities: Design

Skills

Pcb Design • Circuit Design • Design For Manufacturing • Electronics • Signal Integrity • Mixed Signal • Cadence • Manufacturing • Analog • Allegro • Analog Circuit Design • Schematic Capture • Rf • Cad • Eda • Orcad • Pads • Autocad • Computer Aided Design

Ranks

Certificate: C.i.d.

Interests

Spending Time With My Family • Hiking • Biking • Woodworking • Finely Brewed Ales and Ipas

Industries

Consumer Electronics

Resumes

Resumes

Scott Perzanoski Photo 1

Senior Pcb Designer

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Location:
Dudley, MA
Industry:
Consumer Electronics
Work:
Maxtor Jul 1994 - Dec 2000
Senior Pcb Designer

Bose Corporation Jul 1994 - Dec 2000
Senior Pcb Designer

Racal Datacom May 1991 - Jul 1994
Mechanical and Pcb Designer
Education:
Worcester Technical Institute 1989 - 1991
Becker College 1991 - 1991
Associates, General Science
Shepherd Hill Regional High School 1986 - 1989
Skills:
Pcb Design
Circuit Design
Design For Manufacturing
Electronics
Signal Integrity
Mixed Signal
Cadence
Manufacturing
Analog
Allegro
Analog Circuit Design
Schematic Capture
Rf
Cad
Eda
Orcad
Pads
Autocad
Computer Aided Design
Interests:
Spending Time With My Family
Hiking
Biking
Woodworking
Finely Brewed Ales and Ipas
Certifications:
C.i.d.

Publications

Us Patents

Flexible Printed Circuit

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US Patent:
20140190729, Jul 10, 2014
Filed:
Jan 4, 2013
Appl. No.:
13/734189
Inventors:
Drew Stone Briggs - Jamaica Plain MA, US
Scott C. Perzanoski - Dudley MA, US
International Classification:
H05K 1/02
H05K 3/02
US Classification:
174254, 156 60, 156221
Abstract:
A flexible printed circuit includes a first insulating substrate layer and a first electrically conductive layer located adjacent to a first side of the insulating substrate layer. The first conductive layer has a first portion that is substantially solid and a second portion having a multiplicity of voids in the first conductive layer in a pattern for providing a lower stiffness in the second portion relative to the first portion, thereby providing more flexibility in the second portion relative to the first portion.
Scott C Perzanoski from Woodstock, CT, age ~53 Get Report