Adam L Kaplan

8270316, Sep 18, 2012

Jan 30, 2009

12/363182

Jason Cong - Pacific Palisades CA, US
Adam Kaplan - Van Nuys CA, US
Mishali Naik - Long Beach CA, US
Glenn Reinman - Los Angeles CA, US
Eran Socher - Los Angeles CA, US
Chunyue Liu - Los Angeles CA, US

The Regents of the University of California - Oakland CA

H04L 12/28

370254, 370352, 370389, 370392, 370410, 710 52, 710 61, 710116, 710243

An on-chip Radio Frequency (RF) Interconnect (RF-I) for communication between internal circuit nodes of an integrated circuit is provided. In one embodiment, an integrated circuit is provided that includes an on-chip transmission line, a first circuit node associated with an RF transmitter connected to the transmission line, and a second circuit node associated with an RF receiver connected to the transmission line. In order to transmit data from the first circuit node to the second circuit node, the RF transmitter associated with the first circuit node modulates the data onto an RF carrier frequency to provide a modulated RF signal and transmits the modulated RF signal over the transmission line. The RF receiver associated with the second circuit node receives the modulated RF signal from the transmission line and demodulates the modulated RF signal to recover the data for the second circuit node.