Alexander M Latham

20130221753, Aug 29, 2013

Jun 23, 2011

13/805452

David Perreault - Brookline MA, US
Robert Pilawa-Podgurski - Cambridge MA, US
Charles Sullivan - West Lebanon NH, US
Alexander Latham - Norwich VT, US

H02M 7/44

307 77, 363123, 307 82

High power output may be obtained from a photovoltaic (PV) system by controlling each photovoltaic cell of a solar array individually to operate at its maximum power point. Each cell may have associated power electronics and control circuitry that may be integrated together on a chip which may be advantageously implemented in CMOS, enabling reductions in cost and size. A perturb and observe algorithm may be used to find the maximum power point by measuring the power produced at different operating points, and modifying the operating point in the direction of increased power production. In one aspect, performance of a perturb and observe algorithm may be improved in the presence of noise.

20220283200, Sep 8, 2022

Mar 2, 2021

17/189480

- Manchester NH, US
Loïc André Messier - CHENE-EN-SEMINE, FR
Alexander Latham - Harvard MA, US

Allegro MicroSystems, LLC - Manchester NH

G01R 15/20
G01K 7/22
G01R 19/00

According to some embodiments, a device includes: a magnetic field current sensor magnetically coupled to a conductor and configured to generate a magnetic field signal having a magnitude responsive to a current flowing through the conductor; a shunt interface having first and second input terminals electrically coupled to ends of a shunt disposed along the conductor, the shunt interface configured to generate a shunt signal having a magnitude responsive to the current flowing through the conductor; and a diagnostic circuit configured to receive the magnetic field signal and the shunt signal and to generate a fault signal based on a comparison between the magnitude of the magnetic field signal and the magnitude of the shunt signal.

20210405092, Dec 30, 2021

Sep 13, 2021

17/472769

- Manchester NH, US
Paul A. David - Bow NH, US
Shaun D. Milano - Dunbarton NH, US
Rishikesh Nikam - Manchester NH, US
Alexander Latham - Harvard MA, US
Wade Bussing - Manchester NH, US
Natasha Healey - Bedford NH, US
Georges El Bacha - Manchester NH, US

Allegro MicroSystems, LLC - Manchester NH

G01R 15/08
H01L 43/04
H01L 43/06

A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

20210223292, Jul 22, 2021

May 27, 2020

16/884311

- Manchester NH, US
Paul A. David - Bow NH, US
Shaun D. Milano - Dunbarton NH, US
Rishikesh Nikam - Manchester NH, US
Alexander Latham - Harvard MA, US
Wade Bussing - Manchester NH, US
Natasha Healey - Bedford NH, US
Georges El Bacha - Manchester NH, US

Allegro MicroSystems, LLC - Manchester NH

G01R 15/08
H01L 43/06
H01L 43/04

A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

20210033646, Feb 4, 2021

Jul 31, 2019

16/527636

- Manchester NH, US
Alexander Latham - Harvard MA, US

Allegro MicroSystems, LLC - Manchester NH

G01R 15/20
H01L 43/02
H01L 43/06
H01L 43/08

A current sensor can include a lead frame. The lead frame can include a first lead and a second lead, wherein the first and second leads are coupled together at a first junction region of the lead frame, wherein the current sensor is operable to sense a magnetic field generated by a first current passing through the first junction region. The current sensor can further include a first die disposed proximate to the lead frame. The first die can include a first magnetic field sensing element disposed on a surface of the first die, a first circuit coupled to the first magnetic field sensing element for generating a first signal indicative of a first current, and a first node coupled to the first signal. The current sensor can further include a second die disposed proximate to the lead frame. The second die can include a second magnetic field sensing element disposed on a surface of the second die, a second circuit coupled to the second magnetic field sensing element for generating a second signal indicative of the first current passing through the first junction region or indicative of a second current passing through the lead frame and a second node coupled to the second signal.

20200025804, Jan 23, 2020

Sep 30, 2019

16/587284

- Manchester NH, US
Alexander Latham - Harvard MA, US
Shaun D. Milano - Dunbarton NH, US
Christian Feucht - Annecy, FR

Allegro MicroSystems, LLC - Manchester NH

G01R 15/20

Systems and methods described herein are directed towards differential current sensing a current sensor having two or more magnetic field sensing elements that are oriented to sense a magnetic field generated by a current through an external conductor in the same direction. The current sensor can be positioned such that at least one first magnetic field sensing element is vertically aligned with the external conductor and at least one second magnetic field sensing element is not vertically aligned with the external conductor. The magnetic field sensing elements may be spaced from each to measure a gradient field and can generate a magnetic field signal indicative of a distance between the respective magnetic field sensing element and the current carrying external conductor. A difference between the magnetic field signals can be determined that is indicative of the current through the external conductor.

20200018780, Jan 16, 2020

Sep 23, 2019

16/578767

- Manchester NH, US
Rémy Lassalle-Balier - Bures sur Yvette, FR
Alexander Latham - Harvard MA, US
Paolo Campiglio - Arcueil, FR
Noémie Belin - Villejuif, FR

Allegro MicroSystems, LLC - Manchester NH

G01R 15/20
G01R 33/09
G01R 19/00
G01R 17/00

A current sensor can indirectly measure a sensed current by directly measuring static perturbing AC magnetic fields with magnetoresistance elements, the perturbing magnetic fields generated by perturbing coils. The sensed current can be indirectly measured by modulating or changing sensitivities of the magnetoresistance elements in a way that is directly related to the sensed current.

20190391185, Dec 26, 2019

Jun 20, 2018

16/013330

- Manchester NH, US
Evan Shorman - Manchester NH, US
Cory Voisine - Manchester NH, US
Alexander Latham - Harvard MA, US
William P. Taylor - Amherst NH, US

Allegro MicroSystems, LLC - Manchester NH

G01R 15/20
G01R 19/00
G01R 33/09
G01R 33/07

A current sensor integrated circuit including a magnetic field sensing element, a current conductor, an insulation structure, and a power calculation circuit is configured to meet safety isolation requirements. The current sensor integrated circuit may include or be used with isolation resistors to allow for voltage from a high voltage side to be sensed at a low voltage side of the circuit. The insulation structure, current sensor package, and isolation resistors can achieve at least 500 Vrms isolation.