Search

Ali A Farvid

from Palo Alto, CA
Age ~80
Get Report
Also known as:
Ali Te Farvid, Ali S Farvid, Sarvenaz H Farvid, Sarvenaz Haghbin, Farvid Ali, Ali P
Phone and address:
3299 Waverley St, Palo Alto, CA 94306
(949) 306-4875
Connected to:
Colby D Farvour, 38Carla Farward, 58Elaine M Farwell, 55Eleanor C Farwell, 65Lauren N Farwell, 38Lawrence A Farwell, 74Pauline Z Farwell, 97Mary J Farwick, 81Paul D Farwig, 59Peggy A Fary

Ali Farvid Phones & Addresses

  • 3299 Waverley St, Palo Alto, CA 94306 (949) 306-4875 (650) 857-0492
  • 403 El Verano Ave, Palo Alto, CA 94306
  • Cupertino, CA
  • Santa Clara, CA
  • 3299 Waverley St, Palo Alto, CA 94306 (650) 799-5613

Work

Position: Financial Professional

Education

Degree: Graduate or professional degree

Emails

g***[email protected]

Professional Records

Medicine Doctors

Ali Farvid Photo 1

Ali R. Farvid

View page
Specialties:
Cardiovascular Disease
Work:
Kaiser Permanente Medical GroupKaiser Permanente Downy Medical Center
9333 Imperial Hwy, Downey, CA 90242
(562) 657-9000 (phone), (562) 657-4522 (fax)
Languages:
English
Description:
Dr. Farvid works in Downey, CA and specializes in Cardiovascular Disease. Dr. Farvid is affiliated with Kaiser Permanente Medical Center.

Publications

Us Patents

Gas/Ion Species Selective Membrane Support By Multi-Stage Nano-Hole Array Metal Structure

View page
US Patent:
7431838, Oct 7, 2008
Filed:
Aug 9, 2006
Appl. No.:
11/502140
Inventors:
Sangkyun Kang - Seongnam-Si, KR
Yong-Il Park - Kyungbuk, KR
Friedrich B. Prinz - Woodside CA, US
Suk-Won Cha - Stanford CA, US
Yuji Saito - Tokyo, JP
Ali Farvid - Palo Alto CA, US
Pei-Chen Su - Stanford CA, US
Assignee:
The Board of Trustees of the Leland Stanford Junior University - Palo Alto CA
Honda Motor Co., Ltd - Tokyo
International Classification:
B01D 39/00
B01D 17/00
B01D 24/00
B01D 63/00
B32B 15/00
US Classification:
21050025, 210490, 2105232, 2103216, 96 77, 55523, 55524, 428548, 428457, 428381
Abstract:
An improved two-step replication process for fabrication of porous metallic membranes is provided. A negative of a porous non-metallic template is made by infiltration of a liquid precursor into the template, curing the precursor to form a solid negative, and removing the template to expose the negative. Metal is deposited to surround the exposed negative. Removal of the negative provides a porous metallic membrane having pores which replicate the pores of the original template membrane. The negative is kept immersed in a liquid at all times between removing the template and depositing the metal. This immersion eliminates damage to the negative that would be incurred in drying the negative out between these processing steps. Another aspect of the invention is metallic membranes prepared according to the preceding method. For example, metallic membranes having pores smaller on one side than on the other side of the membrane are provided.

Gas/Ion Species Selective Membrane Supported By Multi-Stage Nano-Hole Array Metal Structure

View page
US Patent:
20050242022, Nov 3, 2005
Filed:
Mar 25, 2005
Appl. No.:
11/090658
Inventors:
Sangkyun Kang - Seongnam-Si, KR
Yong-Il Park - Kyungbuk, KR
Friedrich Prinz - Woodside CA, US
Suk-Won Cha - Stanford CA, US
Yuji Saito - Tokyo, JP
Ali Farvid - Palo Alto CA, US
Pei-Chen Su - Stanford CA, US
International Classification:
B01D071/02
US Classification:
210500250, 096004000, 055487000, 210490000, 216056000
Abstract:
An improved two-step replication process for fabrication of porous metallic membranes is provided. A negative of a porous non-metallic template is made by infiltration of a liquid precursor into the template, curing the precursor to form a solid negative, and removing the template to expose the negative. Metal is deposited to surround the exposed negative. Removal of the negative provides a porous metallic membrane having pores which replicate the pores of the original template membrane. The negative is kept immersed in a liquid at all times between removing the template and depositing the metal. This immersion eliminates damage to the negative that would be incurred in drying the negative out between these processing steps. Another aspect of the invention is metallic membranes prepared according to the preceding method. For example, metallic membranes having pores smaller on one side than on the other side of the membrane are provided.

Method For Plating Fine Grain Copper Deposit On Metal Substrate

View page
US Patent:
20150197870, Jul 16, 2015
Filed:
Jan 9, 2015
Appl. No.:
14/593313
Inventors:
- Palo Alto CA, US
Ali A. Farvid - Palo Alto CA, US
International Classification:
C25D 5/34
C25F 3/16
C25D 3/40
C25D 5/18
C25D 3/12
Abstract:
A method of depositing an oxygen-free electronic copper layer on a metal substrate is provided that includes cleaning a substrate surface, electropolishing the substrate surface activating the substrate surface, depositing nickel on the substrate; and depositing copper on the substrate using a cyanide copper strike bath and a cyanide copper plate bath, where a periodic pulse and a reverse periodic pulse current is applied using a pulse periodic reverse current power supply, where the deposited oxygen-free copper comprises a fine-grained, equiaxed structure having a uniform surface geometry and less than 10% thickness variation across all surfaces.
Control profile
Ali A Farvid from Palo Alto, CA, age ~80 Get Report