Charles F Schweitzer

6830176, Dec 14, 2004

Feb 1, 2002

10/061599

Peter Joseph Sinkunas - Canton MI
Zhong-You Shi - Ann Arbor MI
Jay D. Baker - Dearborn MI
Robert Edward Belke - West Bloomfield MI
Charles Frederick Schweitzer - Northville MI
Raymond Eric Foster - Detroit MI
Stephen Edward Fuks - Ann Arbor MI

Visteon Global Technologies, Inc. - Dearborn MI

B23K 3100

228119, 21912164, 174254, 439 44

A new system and method for repairing flexible circuits is disclosed. The flexible circuits conduct electrical signals to and from electronic devices. The system generally includes a flexible circuit substrate, at least one electrical conductor, and a repair patch. The flexible circuit substrate has a cut zone and a repair zone. The at least one electrical conductor is supported by the flexible circuit substrate. The electrical conductors are configured to carry electrical signals. The repair patch is used to electrically interconnect at least two repair zones.

7030977, Apr 18, 2006

May 6, 2003

10/430669

Jay D. Baker - West Bloomfield MI, US
Charles F. Schweitzer - South Lyon MI, US
Zhong-You (Joe) Shi - Ann Arbor MI, US
William Zhang - Troy MI, US

Visteon Global Technologies, Inc. - Van Buren Township MI

G01N 21/00

3562371, 250223 R

The present invention provides a system for the contactless testing and configuring of electronic assemblies during the manufacturing process. The system includes an onboard optical transceiver, a system controller, and a controller optical transceiver. The onboard optical transceiver is located on the electronic assembly. The onboard optical transceiver is connected to an integrated circuit which is capable of performing functional tests or storing programs on the assembly. The controller optical transceiver is connected to the system controller and located adjacent to the electronic assembly. The onboard transceiver and the controller optical transceiver are used to establish a contactless communication link between the system controller and the electronic assembly. The contactless nature of the communication link allows the assembly to be transported past the controller optical transceiver by a simple conveyor while the system controller is communicating with the electronic assembly.

7048423, May 23, 2006

Sep 28, 2001

09/966634

Walter Kuzma Stepanenko - St. Clair Shores MI, US
Jay DeAvis Baker - Dearborn MI, US
Lawrence LeRoy Kneisel - Novi MI, US
Richard Keith McMillan - Dearborn MI, US
Brenda Joyce Nation - Troy MI, US
Cindy Maria Rutyna - Plymouth MI, US
Charles Frederick Schweitzer - Northville MI, US
Peter Langer - Lexington MI, US

Visteon Global Technologies, Inc. - Dearborn MI

B60Q 1/26

362507, 362540, 362545, 3404255

An integrated light and accessory assembly for a vehicle is disclosed. The assembly includes at least one lamp for illumination of a vehicle, and also includes reflective, conductive and insulative portions inside a housing, and a module for controlling or accessorizing the assembly. Also disclosed is a method of manufacturing the assembly. The method includes providing materials for molding or shaping the components of the assembly, selectively etching conductive materials, molding the materials into a desired configuration, connecting a lamp and an accessory module to the conductive portions, and enclosing the components in a housing. A portion of the module may be removed for emergency lighting.

7146579, Dec 5, 2006

Dec 13, 2001

10/023075

Oleg Yurievich Gusikhin - W. Bloomfield MI, US
Rexanne Michelle Owen - Canton MI, US
Charles F. Schweitzer - South Lyon MI, US

Visteon Global Technologies, Inc. - Van Buren Township MI

G06F 17/50
G06F 3/00
G06F 9/45

716 1, 715764, 717141

A method to compile images and data created on different software platforms into a platform-independent image begins when a PCB assembler utilizes a VRML interface to make a request to show an image of a PCB or any part of a PCB. The request is sent to a WWW server, which in turn, contacts a database interface, such as CGI. The requested image data is stored on at least one external database and is likely comprised of many individual elements created on many different software platforms, such as Gerber or CAD. The database interface retrieves the requested image data from the external databases and funnels it to the PCB assembler via the WWW server. Finally, the VRML interface software compiles all of the multi-platform data and generates a new, software- and processor-independent image.

7156279, Jan 2, 2007

Oct 3, 2001

10/149031

Charles Frederick Schweitzer - Northville MI, US
Jason Bullock, legal representative - Detroit MI, US
Shona Bullock, legal representative - Detroit MI, US
Mark D. Miller - Monroe MI, US
Jay DeAvis Baker - Dearborn MI, US
Karen Lee Chiles - Farmington MI, US
Achyuta Achari - Canton MI, US

Visteon Global Technologie, Inc. - Van Bureu Township MI

B23K 1/00

228 46, 228200, 228222

A system and method for reflowing solder to interconnect a plurality of electronic components () to a substrate () is disclosed. The system includes an oven for preheating the substrate () and the plurality of electronic components () disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (), a pallet () for supporting the substrate (), wherein the pallet () has at least one internal cavity (), and a phase-transition material () disposed within the cavity () for absorbing heat from the pallet ().

7589459, Sep 15, 2009

Dec 7, 2006

11/635167

Muhammed Aqil Hamid - Canton MI, US
Charles Frederick Schweitzer - Livonia MI, US
Nasir Mahmood - Canton MI, US

Automotive Components Holdings, LLC - Dearborn MI

H01J 7/24

313 33, 313112

A thermal filter is provided within a vehicle lamp assembly for reducing thermal radiation from reaching selected portions of the lamp assembly from an illumination light source disposed within the vehicle lamp. The thermal filter includes an inner envelope and an outer envelope in spaced relation to the inner envelope. The inner envelope and the outer envelope define a closed chamber therebetween. The closed chamber being disposed between the illumination light source and the selected portions of the lamp assembly. The inner envelope includes an interior portion. A thermal radiation absorbing agent disposed within the closed chamber. The thermal radiation absorbing agent receives radiation emitted from the illumination source. The thermal radiation absorbing agent is transparent to short wave visible radiation and is substantially opaque to long wave infrared radiation. A substantial portion of the long wave infrared radiation absorbed by the absorbing agent is retained within the closed chamber.

20040050915, Mar 18, 2004

Aug 1, 2003

10/148932

Lakhi Goenka - Ann Arbor MI, US
Lawrence Bullock - Detroit MI, US
Jason Bullock - Detroit MI, US
Shona Bullock - Detroit MI, US
Peter Sinkunas - Canton MI, US
Charles Schweitzer - Northville MI, US
Mark Miller - Monroe MI, US
Raymond Foster - Detroit MI, US
Stephen Fuks - Ann Arbor MI, US
Thomas Krautheim - Belleville MI, US

B23K031/02

228/248100, 228/233200, 228/043000

A system and method for reflowing solder to interconnect a plurality of electronic components () to a substrate () is disclosed. The system includes an oven for preheating the substrate () and the plurality of electronic components () disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (), a pallet () for supporting the substrate (), wherein the pallet () has at least one internal cavity (), and a phase-transition material () disposed within the cavity () for absorbing heat from the pallet ().

63201283, Nov 20, 2001

May 25, 2000

9/578394

Andrew Zachary Glovatsky - Plymouth MI
Brenda Joyce Nation - Troy MI
Charles Frederick Schweitzer - Northville MI
Daniel Phillip Dailey - West Bloomfield MI
Delin Li - Canton MI
Jay DeAvis Baker - Dearborn MI
Lakhi Nandlal Goenka - Ann Arbor MI
Lawrence LeRoy Kneisel - Novi MI
Myron Lemecha - Dearborn Heights MI

Visteon Global Technology, Inc. - Dearborn MI

H01L 2328
H05K 506

174 522

An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly. Preferably, a relatively-rigid polymeric material is formed in touching contact with the substrate, as by overmolding the plastic material on the environmentally-sealed assembly, to thereby provide a plastic part incorporating the assembly.