Danny Te Cohen

7525199, Apr 28, 2009

May 21, 2004

10/851835

Gary R. Lauterbach - Los Altos Hills CA, US
Danny Cohen - Pacific Palisades CA, US
Robert J. Drost - Mountain View CA, US

Sun Microsystems, Inc - Santa Clara CA

H01L 23/48

257777, 257723, 438107

A plurality of integrated circuit packages are disposed on a substrate. The plurality of integrated circuit packages includes a first type of integrated circuit package that has an inactive side facing the substrate and an active side facing away from the substrate. The plurality of integrated circuit packages also includes a second type of integrated circuit package that has an inactive side facing away from the substrate and an active side facing the substrate. The first type of integrated circuit package and the second type of integrated circuit package are disposed such that a proximity communication enabled portion of the first type of integrated circuit package is aligned with a proximity communication enabled portion of the second type of integrated circuit package.

7561584, Jul 14, 2009

Nov 9, 2005

11/270010

Bernard Tourancheau - Miribel, FR
Henri Gouraud - Hyères, FR
Danny Cohen - Santa Monica CA, US
Ivan Sutherland - Santa Monica CA, US

Sun Microsystems, Inc. - Santa Clara CA

H04L 12/28
G06F 15/173

370400, 709223

A system, including at least one central processing unit, at least one memory unit, and a plurality of integrated circuits that form a switching fabric configured to propagate data packets between the at least one central processing unit and the at least one memory unit, wherein the switching fabric is constructed using at least two directed acyclic graph (DAG) networks.

7573720, Aug 11, 2009

Jun 15, 2005

11/154392

Robert J. Drost - Mountain View CA, US
Gary R. Lauterbach - Los Altos Hills CA, US
Danny Cohen - Pacific Palisades CA, US

Sun Microsystems, Inc. - Santa Clara CA

H05K 7/00

361760, 257679, 257778

One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The system additionally includes an integrated circuit chip having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. Additionally, the integrated circuit chip is pressed against the substrate such that the active face of the integrated circuit chip is parallel to and adjacent to the active face of the substrate, and capacitive signal pads on the active face of the integrated circuit chip overlap signal pads on the active face of the substrate. The arrangement of the substrate and integrated circuit chip facilitates communication between the integrated circuit chip and the substrate through capacitive coupling via the overlapping signal pads.

7660842, Feb 9, 2010

May 12, 2003

10/436577

Josephus C. Ebergen - San Francisco CA, US
Ivan E. Sutherland - Santa Monica CA, US
Danny Cohen - Pacific Palisades CA, US

Sun Microsystems, Inc. - Santa Clara CA

G06F 7/52

708650

One embodiment of the present invention provides a system that performs a carry-save division operation that divides a numerator, N, by a denominator, D, to produce an approximation of the quotient, Q=N/D. The system approximates Q by iteratively selecting an operation to perform based on higher order bits of a remainder, r, and then performing the operation, wherein the operation can include, subtracting D from r and adding a coefficient c to a quotient calculated thus far q, or adding D to r and subtracting c from q. These subtraction and addition operations maintain r and q in carry-save form, which eliminates the need for carry propagation and thereby speeds up the division operation. Furthermore, the selection logic is simpler than previous SRT division implementations, which provides another important speed up.

8166644, May 1, 2012

Jul 6, 2009

12/498282

Robert J. Drost - Mountain View CA, US
Gary R. Lauterbach - Los Altos Hills CA, US
Danny Cohen - Pacific Palisades CA, US

Oracle America, Inc. - Redwood Shores CA

H05K 3/30

29834, 29854, 438108

One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The system additionally includes an integrated circuit chip having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. Additionally, the integrated circuit chip is pressed against the substrate such that the active face of the integrated circuit chip is parallel to and adjacent to the active face of the substrate, and capacitive signal pads on the active face of the integrated circuit chip overlap signal pads on the active face of the substrate. The arrangement of the substrate and integrated circuit chip facilitates communication between the integrated circuit chip and the substrate through capacitive coupling via the overlapping signal pads.

20050122907, Jun 9, 2005

Oct 31, 2003

10/699412

Josephus Ebergen - San Francisco CA, US
Danny Cohen - Pacific Palisades CA, US

H04L012/26

370235000

One embodiment of the present invention provides a system that regulates communications between a plurality of transmitters and a receiver. The system comprises a plurality of cells, wherein each cell controls communications from a transmitter in the plurality of transmitters to the receiver. A single token flows through a ring which passes through the plurality of cells, wherein the presence of the token within a cell indicates that the corresponding transmitter may communicate with the receiver.

7460035, Dec 2, 2008

Jul 3, 2007

11/773181

Ronald Ho - Mountain View CA, US
Danny Cohen - Palo Alto CA, US
Robert J. Drost - Los Altos CA, US

Sun Microsystems, Inc. - Santa Clara CA

H03M 5/00

341 58, 341 50

Embodiments of an encoding circuit to communicate a sequence of words are described. This encoding circuit includes an encoding module that is configured to receive a first sequence of words and to generate a DC-balanced second sequence of words based on the first sequence of words, where communicating the second sequence of words consumes less energy than communicating a third sequence of words that includes words in the first sequence of words alternating with words in the inverse of the first sequence of words. In addition, the second sequence of words includes substantially twice as many words as the first sequence of words.