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Duane D Wendling

from Kutztown, PA
Age ~64
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Also known as:
Donald J Wendling
Phone and address:
1340 Eagle Point Rd, Greenwich, PA 19530
(610) 683-5881
Related to:
Austin M Wendling, 31George L WendlingAlicia Wendling, 33Aurey Amato, 40Alexander Wendling, 38Ethan Wendling, 33
Connected to:
Andrew J Wendling, 50Kelle B Wendling, 53Lee A Wendling, 45Mike J Wendling, 57Shawn Wendling, 65Todd A Wendling, 48Melissa L Wendoll, 62Ann C Wendorff, 79Crystal WendorfFred M Wendorf, 43

Duane Wendling Phones & Addresses

  • 1340 Eagle Point Rd, Kutztown, PA 19530 (610) 683-5881
  • Macungie, PA

Skills

Microsoft Office • Management • Microsoft Excel • Microsoft Word • Research • Powerpoint • Sales • Leadership • Training • Photoshop • Security

Resumes

Resumes

Duane Wendling Photo 1

Duane Wendling

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Skills:
Microsoft Office
Management
Microsoft Excel
Microsoft Word
Research
Powerpoint
Sales
Leadership
Training
Photoshop
Security

Business Records

Name / Title
Company / Classification
Phones & Addresses
Duane Wendling
Owner
Wendling's Traditional Cabinets
Ret Furniture
1340 Eagle Pt Rd, Greenwich, PA 19530
(610) 683-5881

Publications

Us Patents

In-Situ Automated Contactless Thickness Measurement For Wafer Thinning

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US Patent:
6437868, Aug 20, 2002
Filed:
Oct 28, 1999
Appl. No.:
09/429327
Inventors:
David Gerald Coult - Bechtelsville PA
Duane Donald Wendling - Kutztown PA
Charles William Lentz - Lower Heidleburg Township PA
Bryan Phillip Segner - Upper Macungie PA
Gustav Edward Derkits - New Providence NJ
Wan-ning Wu - Springfield VA
Franklin Roy Dietz - Mohnton PA
Assignee:
Agere Systems Guardian Corp. - Berkeley Heights NJ
International Classification:
G01B 1106
US Classification:
356630, 356632, 438 14, 438 16, 438692, 269 21, 118712, 279 3
Abstract:
A system for measuring the thickness of a wafer while it is being thinned this disclosed. The system and method provide integrating an optical reflectometer into a common wafer thinning apparatus. Using reflected optical signals from the top and bottom of the wafer, the thickness of the wafer is determined with time based calculations in real-time while thinning is occurring. Once the desired thickness has been reached, the thinning operation is halted. By performing the measurement in-situ, this system and a method prevent scrapping of wafers which are overthinned and the reloading of wafers which are too thick. Since an optical reflectometer is used, the measurement is contactless, and thus prevents possible damage to wafers during measurement.

Fixture With At Least One Trough And Method Of Using The Fixture In A Plasma Or Ion Beam

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US Patent:
62105469, Apr 3, 2001
Filed:
Oct 29, 1998
Appl. No.:
9/182722
Inventors:
David G. Coult - Oley PA
Gustav E. Derkits - New Providence NJ
Walter J. Shakespeare - Macungie PA
Duane D. Wendling - Kutztown PA
Frederick A. Yeagle - Leesport PA
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
C23C 1446
C23C 1450
C23F 100
US Classification:
20419232
Abstract:
Optical components, such as optical semi-isolators, are placed in a fixture that exposes at least a portion of the mounting surface of each optical component when a plasma or ion beam is directed at one side of the fixture, while shielding sensitive surfaces of the optical components (e. g. , an optical element mounted within the frame of the optical component) from direct exposure to the plasma or ion beam. Exposure to the plasma or ion beam removes contaminants (e. g. , metal oxide) that form on the mounting surface during the fabrication of the optical components when the optical element is mounted within its frame using glass solder in a heated oxygenated environment (e. g. , air). By removing enough of the contaminants, the plasma or ion beam cleaning step produces optical components that can be reliably mounted onto substrates, such as the ceramic substrates used in encapsulated laser packages, using flux-less auto-bonding techniques.
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Duane D Wendling from Kutztown, PA, age ~64 Get Report