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Gabor E Kardos

from Rancho Murieta, CA
Deceased

Gabor Kardos Phones & Addresses

  • 15018 Venado Dr, Rncho Murieta, CA 95683
  • Rancho Murieta, CA
  • Campbell, CA
  • 601 Van Ness Ave, San Francisco, CA 94102
  • 422 Ives Ter, Sunnyvale, CA 94087
  • Highland, CA
  • Santa Clara, CA
  • Sacramento, CA
  • Lovettsville, VA

Business Records

Name / Title
Company / Classification
Phones & Addresses
Gabor Kardos
President
Adapters.Com Inc
Mfg Electrical Measuring Instruments
1400 Coleman Ave, Santa Clara, CA 95050
Gabor Kardos
President
Supercoach International Inc
Mfg/Whol/ Ret Tennis Ball Machines
2294 Walsh Ave, Santa Clara, CA 95050
(408) 855-9644
Gabor Kardos
President
ADAPTERS.COM
Electrical/Electronic Manufacturing · Instrument Manufacturing for Measuring and Testing Electrici
3024 Scott Blvd, Santa Clara, CA 95054
(408) 855-8527

Publications

Us Patents

Adapter Which Emulates Ball Grid Array Packages

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US Patent:
54184711, May 23, 1995
Filed:
Jan 26, 1994
Appl. No.:
8/187578
Inventors:
Gabor Kardos - Sunnyvale CA
Assignee:
Emulation Technology, Inc. - Santa Clara CA
International Classification:
G01R 104
US Classification:
324758
Abstract:
An adapter for emulating a ball grid array type package includes a dielectric substrate having an array of holes formed therein. A layer of conductive material is deposited on a bottom surface of the substrate and onto the inner walls of the holes. The bottom surface of the substrate is then selectively etched to form separate conductive traces extending from each of said holes and terminating in a pad proximate to each hole. A conductive pin is inserted into each of the holes and soldered in place. The pads are then provided with a small ball of solder, using well known techniques, so that the bottom surface of the substrate now appears virtually identical to a bottom surface of a conventional ball grid array type package. The adapter is then mounted to an array of contact pads on a printed circuit board by fusing the solder balls to corresponding contact pads on the board. The pins are now electrically connected to the contact pads on the circuit board and may be connected to a tester.

Adapter Which Emulates Ball Grid Array Packages

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US Patent:
RE364428, Dec 14, 1999
Filed:
May 16, 1997
Appl. No.:
8/857889
Inventors:
Gabor Kardos - Sunnyvale CA
Assignee:
Emulation Technology, Inc. - Santa Clara CA
International Classification:
G01R 104
US Classification:
324758
Abstract:
An adapter for emulating a ball grid array type package includes a dielectric substrate having an array of holes formed therein. A layer of conductive material is deposited on a bottom surface of the substrate and onto the inner walls of the holes. The bottom surface of the substrate is then selectively etched to form separate conductive traces extending from each of said holes and terminating in a pad proximate to each hole. A conductive pin is inserted into each of the holes and soldered in place. The pads are then provided with a small ball of solder, using well known techniques, so that the bottom surface of the substrate now appears virtually identical to a bottom surface of a conventional ball grid array type package. The adapter is then mounted to an array of contact pads on a printed circuit board by fusing the solder balls to corresponding contact pads on the board. The pins are now electrically connected to the contact pads on the circuit board and may be connected to a tester.

Test Adapter For Packaged Integrated Circuits

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US Patent:
54771617, Dec 19, 1995
Filed:
Jan 18, 1995
Appl. No.:
8/375051
Inventors:
Gabor Kardos - Sunnyvale CA
Norma J. Kardos - Sunnyvale CA
Assignee:
Emulation Technology, Inc. - Santa Clara CA
International Classification:
G01R 0102
US Classification:
324755
Abstract:
A test clip, or test adapter, is provided for connecting leads of a tester to terminals on a packaged integrated circuit. Spacers on the test clip, which act to precisely separate the contact pins, are formed separately using a stamping process. Spacers may be formed having a thickness which can be controlled to approximately one mil. Each of the individual spacers is sandwiched between two contact pins to provide precise spacing of the contact pins. A bar is inserted through a hole in each of the spacers and contact pins to form a linear array of contact pins and spacers. Two or four (as appropriate) of the linear arrays of contact pins/spacers are then mounted on a test clip body sized for a specific integrated circuit package. Each of the spacers may include an L-shaped extension which is urged under the integrated circuit package when the test clip is pressed onto the package so as to firmly secure the test clip to the package.
Gabor E Kardos from Rancho Murieta, CADeceased Get Report