Search

Gerard L Maloney

from Berkeley, CA
Age ~73
Get Report
Also known as:
Gerard Leo Maloney, Ingrid Maloney, Gerald L Maloney, Gerry Maloney
Phone and address:
1022 Creston Rd, Berkeley, CA 94708
(510) 525-1557
Related to:
Jen Maloney, 52Gerald MaloneyShana Maloney, 37Cynthia Traver, 51Jenniferle Maloney, 52Charles Traver, 81
Connected to:
Aubrey A Maloney, 41Carolyn B Maloney, 76Celeste A Maloney, 48Jackson C Maloney, 35Jacquelyn M Maloney, 81Joanne Maloney, 75Lin M Maloney, 68Linda M Maloney, 71Marcie G Maloney, 71Matt M Maloney, 35

Gerard Maloney Phones & Addresses

  • 1022 Creston Rd, Berkeley, CA 94708 (510) 525-1557
  • 2309 Oregon St, Berkeley, CA 94705 (510) 849-2166
  • Carlsbad, CA
  • La Jolla, CA
  • Pawtucket, RI
  • Oakland, CA
  • Wenham, MA
  • Walnut Creek, CA
  • Alameda, CA
  • Rochester, NH
  • San Francisco, CA

Publications

Us Patents

Apparatus And Method For Chemical-Mechanical Polishing (Cmp) Head Having Direct Pneumatic Wafer Polishing Pressure

View page
US Patent:
6368189, Apr 9, 2002
Filed:
Sep 3, 1999
Appl. No.:
09/390142
Inventors:
Gerard S. Maloney - Milpitas CA
Jason Price - Eugene OR
Scott Chin - Palo Alto CA
Jiro Kajiwara - Cupertino CA
Malek Charif - San Jose CA
Assignee:
Mitsubishi Materials Corporation - Tokyo
International Classification:
B24B 100
US Classification:
451 41, 451 63, 451288, 451398
Abstract:
A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the wafer at a peripheral edge. The resilient pneumatic annular sealing bladder defines a second pneumatic zone radially interior to the first pneumatic zone and extends between the first surface of the wafer stop plate and the wafer when the wafer is attached to the polishing head during a polishing operation and is coupled for fluid communication to a second pressurized pneumatic fluid. The wafer attachment stop plate is operative during non polishing periods to prevent the wafer from flexing excessively from an applied vacuum force used to hold the wafer to the polishing head during wafer loading and unloading operations.

Apparatus For Chemical-Mechanical Polishing (Cmp) Head Having Direct Pneumatic Wafer Polishing Pressure

View page
US Patent:
7029382, Apr 18, 2006
Filed:
Dec 21, 2001
Appl. No.:
10/027935
Inventors:
Gerard S. Maloney - Milpitas CA, US
Jason Price - Eugene OR, US
Scott Chin - Palo Alto CA, US
Jiro Kajiwara - Cupertino CA, US
Malik Charif - San Jose CA, US
Assignee:
Ebara Corporation - Tokyo
International Classification:
B24B 29/00
US Classification:
451288, 451290, 451398
Abstract:
A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the wafer at a peripheral edge. The resilient pneumatic annular sealing bladder defines a second pneumatic zone radially interior to the first pneumatic zone and extends between the first surface of the wafer stop plate and the wafer when the wafer is attached to the polishing head during a polishing operation and is coupled for fluid communication to a second pressurized pneumatic fluid. The wafer attachment stop plate is operative during non polishing periods to prevent the wafer from flexing excessively from an applied vacuum force used to hold the wafer to the polishing head during wafer loading and unloading operations.

Chemical Mechanical Polishing Head Assembly Having Floating Wafer Carrier And Retaining Ring

View page
US Patent:
7044838, May 16, 2006
Filed:
Feb 27, 2004
Appl. No.:
10/789773
Inventors:
Gerard S. Maloney - Milpitas CA, US
Scott Chin - Palo Alto CA, US
John J. Geraghty - Burlingame CA, US
William Dyson, Jr. - San Jose CA, US
Tanlin K. Dickey - Sunnyvale CA, US
Assignee:
EBARA Corporation - Tokyo
International Classification:
B24B 1/00
US Classification:
451 41, 451 63, 451288
Abstract:
The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms. The invention also provides a retaining ring having a special edge profile that assists in smoothing an pre-compressing the polisihng pad to increase polisihng uniformity.

Apparatus And Method For Chemical-Mechanical Polishing (Cmp) Head Having Direct Pneumatic Wafer Polishing Pressure

View page
US Patent:
7311586, Dec 25, 2007
Filed:
Jan 31, 2006
Appl. No.:
11/345199
Inventors:
Gerard S. Maloney - Milpitas CA, US
Jason Price - Eugene OR, US
Scott Chin - Palo Alto CA, US
Jiro Kajiwara - Cupertino CA, US
Malik Charif - San Jose CA, US
Assignee:
Ebara Corporation - Tokyo
International Classification:
B24B 1/00
B24B 5/02
US Classification:
451 41, 451 63, 451288, 451398
Abstract:
A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the wafer at a peripheral edge. The resilient pneumatic annular sealing bladder defines a second pneumatic zone radially interior to the first pneumatic zone and extends between the first surface of the wafer stop plate and the wafer when the wafer is attached to the polishing head during a polishing operation and is coupled for fluid communication to a second pressurized pneumatic fluid. The wafer attachment stop plate is operative during non polishing periods to prevent the wafer from flexing excessively from an applied vacuum force used to hold the wafer to the polishing head during wafer loading and unloading operations.

Chemical Mechanical Polishing Head Assembly Having Floating Wafer Carrier And Retaining Ring

View page
US Patent:
62314289, May 15, 2001
Filed:
Mar 3, 1999
Appl. No.:
9/261112
Inventors:
Gerard S. Maloney - Milpitas CA
Scott Chin - Palo Alto CA
John J. Geraghty - Burlingame CA
William Dyson - San Jose CA
Tanlin K. Dickey - Sunnyvale CA
Assignee:
Mitsubishi Materials Corporation - Tokyo
International Classification:
B24B 500
US Classification:
451 41
Abstract:
The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms. The invention also provides a retaining ring having a special edge profile that assists in smoothing an pre-compressing the polisihng pad to increase polisihng uniformity.
Control profile
Gerard L Maloney from Berkeley, CA, age ~73 Get Report