Inventors:
Sevgin Oktay - Poughkeepsie NY
Gerard J. Torgersen - Pawling NY
Alexander C. Wong - Wappingers Falls NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 2504
H01L 3902
Abstract:
A structure for cooling high density integrated circuit devices composed of a heat sink bonded to the backside of the integrated circuit devices. The integrated circuit devices are mounted on a board and the board positioned so that the tunnels in the heat sink are oriented vertically. The tunnels are totally immersed in a liquid so that the integrated circuit devices are cooled by nucleate boiling and bubbles form within the tunnels and propagate out of the tunnels.