Jean-Philippe Fricker

7636506, Dec 22, 2009

May 12, 2004

10/843898

Jean-Philippe Fricker - Mountain View CA, US

Alcatel-Lucent USA Inc. - Murray Hill NJ

G02B 6/00

385134, 385135

A technique for optical fiber management in a chassis-based network system involves using a blind mating optical interface at the back of a line card and an optical transceiver interface that is accessible from the front of the line card. The blind mating optical interface and the transceiver interface are optically connected by an optical signal path that includes and optical fiber. When the line card is secured within a compatible chassis, the blind mating optical interface of the line card connects to a blind mating optical interface of the chassis and creates an optical connection between an external optical fiber and the transceiver interface.

20010013855, Aug 16, 2001

Jun 12, 1998

09/097235

JEAN-PHILIPPE FRICKER - MOUNTAIN VIEW CA, US
MAURICE ALOU - MENLO PARK CA, US
BERNARD KASSER - REDWOOD CITY CA, US

G09G005/00

345/156000

A touchpad having the advantages of resistive and capacitive type sensors. A capacitive sensor is stacked above a 5-wire resistive sensor. The touchpad is of integrated manufacture with one of conductive plates of the resistive sensor printed on a first substrate, and the other conductive plate printed on the second substrate with the capacitive sensor. The touchpad is configurable to distinguish between a finger and a pen, and operate in different modes depending on which is being used.

20120206116, Aug 16, 2012

Feb 11, 2011

13/025787

Jean-Philippe Fricker - Mountain View CA, US

Alcatel-Lucent USA Inc. - Murray Hill NJ

H02M 3/158

323271

Systems and methods for actively reducing or eliminating conducted noise from power provided to DC circuits include a current sensor, a boost converter, a buck converter, and energy supply capacitors. The current sensor senses the input current provided by the power source. The boost converter increases the voltage level above that provided by the power source while maintaining current at or near the level sensed by the current sensor, and while also maintaining a charge on the energy supply capacitors. The buck converter is powered by the output from the boost converter and provides an output voltage to a load. The operation of the boost converter and the buck converter may be controlled to maintain a continuous and low ripple current from the power source and to maintain a continuous and low ripple voltage to the load.

20130334890, Dec 19, 2013

Jun 13, 2012

13/495325

Jean-Philippe Fricker - Mountain View CA, US

Advanced Micro Devices, Inc. - Sunnyvale CA

H01F 38/00

307104

A contactless connector requires no physical contact. A terminated transmitting transmission line on a first board is parallel to a dual-terminated receiving transmission line on a second board. The boards are placed face-to-face with a small air gap in-between. A driver drives a driven pulse onto a first end of the transmitting transmission line. The driven pulse capacitively induces a positive induced pulse on the first end of the receiving transmission line. As the driven pulse travels from the first end to the second end of the transmitting transmission line, energy is transferred to the induced pulse, which travels down the receiving transmission line. Inductive coupling becomes stronger than capacitive as the length increases, so that at the second end, the induced pulse is negative and then swings positive. A Schmitt trigger receiver on the second end of the receiving transmission line detects the signal.

20130342996, Dec 26, 2013

Jun 22, 2012

13/530958

Jean-Philippe Fricker - Mountain View CA, US

ADVANCED MICRO DEVICES, INC. - Sunnyvale CA

H05K 7/20

361695

An electronics chassis has many removable boards on sleds that are interconnected by a honeycomb interconnect structure. Interconnect boards in Y-planes and Z-planes are orthogonal to each other and form cells. Cooling air flows through the cells in an X direction, parallel to surfaces of the interconnect boards. The removable boards have connectors that mate with an edge of Z-divider interconnect boards. Fans blow air through the cells in the honeycomb structure unimpeded since no boards are perpendicular to the airflow. Notches in the rear of the Z-divider boards provide airflow equalization allowing closer spacing of fans to the honeycomb structure. A sled carrier honeycomb structure is placed in front of the honeycomb interconnect structure to guide sleds into position. Sled carrier dividers are offset from the Z-divider boards to allow removable boards to align with Z-divider boards in the Z-planes, parallel to airflow.

6480183, Nov 12, 2002

Jul 23, 1999

09/360479

Gilles Van Ruymbeke - Menlo Park CA
Bernard Kasser - Ceyreste, FR
Jean-Philippe Fricker - Mountain View CA
Marc Ledin - Menlo Park CA

Logitech Europe S.A. - Fremont CA

G09G 508

345161, 324660

A joystick that detects position and movement using a capacitive sensor. The joystick has a stick mounted to allow movement within a housing, a conductive element at a first end of the stick, and a capacitive sensor. The capacitive sensor may be a capacitive touchpad. It determines position by measuring the change in capacitance on a set of conductive traces. The capacitive sensor may be shaped as a plane or may be hemispherically-shaped. The conductive element may also be triangular or other distinctive shape to allow detection of movement. An advantage of such a joystick is that absolute positioning may be determined, along with relative positioning.

20220278068, Sep 1, 2022

May 20, 2022

17/749507

- Los Altos CA, US
Jean-Philippe Fricker - Los Altos CA, US

H01L 23/00
H01L 23/538
H01L 25/065

An integrated circuit assembly that includes a semiconductor wafer having a first coefficient of thermal expansion; an electronic circuit substrate having a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion; and an elastomeric connector arranged between the semiconductor wafer and the electronic circuit substrate and that forms an operable signal communication path between the semiconductor wafer and the electronic circuit substrate.

20210167037, Jun 3, 2021

Feb 12, 2021

17/175221

- Los Altos CA, US
Jean-Philippe Fricker - Los Altos CA, US

H01L 23/00
G03F 7/20
H01L 21/66

A system and method for fabricating distinct types of circuit connections on a semiconductor wafer includes fabricating, using a first photomask, a plurality of a first type of circuit connections for each of a plurality of distinct die of a semiconductor wafer; and fabricating, using a second photomask, a plurality of a second type of circuit connections between a plurality of distinct pairs of components of the semiconductor wafer, wherein each distinct pair of components includes at least one distinct die of the plurality of distinct die and one of a conductive pad and a sacrificial die.