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Jonathan D Halderman

from Sunnyvale, CA
Age ~52
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Also known as:
Jonathan Dale Halderman, Jonathan D Alderman, Jonathn D Halderman, Johnathan Halderman
Phone and address:
1109 Lorne Way, Sunnyvale, CA 94087
Related to:
Irene T Halderman, 80Jacqueline D Brooks, 52Kerry L Harbst, 55John E HaldermanJacquelin D Brooks, 52Michelle D Kennedy, 52Abraham J HarbstSandra D Brooks, 55
Connected to:
David L Halderman, 84Laura K Halderman, 44Tyler S Halderman, 34Charles G Haldi, 87Nicole C Haldiman, 50Jennifer L Haldorson, 46Adrienne S Hale, 39Aeon M Hale, 44Aleda J Hale, 74Allean L Hale, 109

Jonathan Halderman Phones & Addresses

  • 1109 Lorne Way, Sunnyvale, CA 94087
  • 3439 Machado Ave, Santa Clara, CA 95051
  • Altoona, PA
  • San Jose, CA
  • University Park, PA
  • Oakland, CA
  • Boiling Spgs, PA
  • Mountain View, CA
  • 1109 Lorne Way, Sunnyvale, CA 94087 (650) 303-6722

Work

Company: Jonathan halderman - independent consultant May 2013 Address: Sunnyvale, CA Position: Technical consultant

Education

Degree: MSME School / High School: Stanford University 1994 to 1995 Specialities: Thermosciences

Industries

Industrial Automation

Resumes

Resumes

Jonathan Halderman Photo 1

Technical Consultant At Jonathan Halderman - Independent Consultant

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Position:
Technical Consultant at Jonathan Halderman - Independent Consultant
Location:
San Francisco Bay Area
Industry:
Industrial Automation
Work:
Jonathan Halderman - Independent Consultant - Sunnyvale, CA since May 2013
Technical Consultant
GenapSys - Redwood City, CA Feb 2013 - May 2013
Director of System Integration
ESI - Fremont, CA Jun 2010 - Feb 2013
Director of Technology and Engineering
CellScape Corporation Jun 2009 - Sep 2010
Principal Engineer/ Technical Advisor
Electroglas, Inc. Sep 2008 - Jun 2009
Chief Technology Officer
Education:
Stanford University 1994 - 1995
MSME, Thermosciences Penn State University 1989 - 1994
BS, Engineering Science and Mechanics

Business Records

Name / Title
Company / Classification
Phones & Addresses
Jonathan Halderman
Information Technology Manager
Electroglas International, Inc
Mfg Misc Industry Machinery
5729 Fontanoso Way, San Jose, CA 95138
(408) 528-3000
Jonathan D. Halderman
President, President Mechanical Engineer Software Engineer
PRECISION INSTRUMENTATION DESIGN, INC
Mfg Analytical Instruments
3439 Machado Ave, Santa Clara, CA 95051
(408) 855-8208, (408) 521-0253
Jonathan D. Halderman
Precision Instrumentation Design LLC
Professional Engineering Services
2916 Scott Blvd, Santa Clara, CA 95054
3004 Scott Blvd, Santa Clara, CA 95054
(408) 855-8726

Publications

Us Patents

Detection Of Flux Residue

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US Patent:
6367679, Apr 9, 2002
Filed:
Aug 22, 2000
Appl. No.:
09/642831
Inventors:
Raj N. Master - San Jose CA
Jonathan D. Halderman - San Jose CA
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
B23K 3112
US Classification:
228103, 228104, 73 711
Abstract:
Detection of flux residue remaining the formation of a device/substrate assembly is carried out by contacting the assembly with a fixed amount of solvent adapted to remove residual flux from the assembly and measuring the conductivity or resistance of the contacted solvent to determine the presence of flux residue in the solvent obtained from the assembly. Embodiments include contacting the assembly with isopropanol by immersing and withdrawing the assembly in a fixed amount of the solvent and measuring the conductivity of the contacted solvent with a volt meter.

Method To Reduce Occurrences Of Fillet Cracking In Flip-Chip Underfill

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US Patent:
6372544, Apr 16, 2002
Filed:
Jun 23, 2000
Appl. No.:
09/599530
Inventors:
Jonathan D. Halderman - San Jose CA
Raj N. Master - San Jose CA
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
H01L 2144
US Classification:
438108, 438106, 438127
Abstract:
A softened and compliant fillet portion of a cured polymeric underfill in a flip-chip arrangement reduces occurences of fillet crackings caused by thermal stresses. The softening of the fillet is achieved by chemically breaking cross-links in the cured polymeric underfill material using a chemical solvent. In another embodiment, the softening of the fillet is achieved by applying heat using a controllable beam of thermal energy to break up the cross-links to thereby soften the fillet.

Method For Measurement Of Duration Of Molten State For Solder During Reflow

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US Patent:
6379036, Apr 30, 2002
Filed:
May 26, 2000
Appl. No.:
09/578454
Inventors:
Jonathan D. Halderman - San Jose CA
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
G09F 700
US Classification:
368101, 368114, 368327, 116206, 116217, 374102
Abstract:
An instrument and a method for measuring a duration at or above a predetermined temperature, such as a solder reflow temperature, are disclosed. The instrument includes a capillary tube and an indicator material that is solid at temperatures below the predetermined temperature and a liquid that will move into and through the capillary tube at and above the predetermined temperature. In the method according to the invention, an instrument according to the invention is heated, then cooled. The amount of indicator material in the capillary tube indicates how much time the instrument spent at temperatures at or above the predetermined temperature. The instrument and method are useful, for instance, for indicating the length of time an integrated circuit package is at or above a solder reflow temperature during manufacturing processes.

Inline Flux Measurement System

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US Patent:
6399902, Jun 4, 2002
Filed:
Aug 1, 2000
Appl. No.:
09/630414
Inventors:
Terri J. Brownfield - Boulder Creek CA
Jonathan D. Halderman - San Jose CA
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
G01G 1300
US Classification:
177 60, 177116, 702173, 427 96, 222 55, 295921, 438106
Abstract:
This invention is directed to controlling the amount of flux dispensed onto the surface of an IC component. The component is continually weighed and data is fed back to a controller that controls the dispensing of flux onto the IC component. When the proper amount of flux is dispensed, the controller terminates the dispensing of the flux.

Spring Frame For Protecting Packaged Electronic Devices

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US Patent:
6417563, Jul 9, 2002
Filed:
Jul 14, 2000
Appl. No.:
09/617102
Inventors:
Jonathan Halderman - San Jose CA
Mohammad Khan - San Jose CA
Alexander C. Tain - Milpitas CA
Tom Ley - Cupertino CA
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
H05K 720
US Classification:
257718, 257707, 257719, 361719
Abstract:
An integrated circuit arrangement comprising an integrated circuit package having a package board. An integrated circuit die is mounted to a surface of the package board. A spring frame is mounted to the package board surface at a pair of opposite frame bends. The spring frame has a central opening that receives the integrated circuit die. Sides of the spring frame away from the bends are raised from the package surface. A heat sink is mounted to the spring frame such that a bottom of the heat sink contacts an upper surface of the integrated circuit die as the heat sink pushes the sides of the spring frame toward the package surface.

Removing Flux Residue From Reflow Furnace Using Active Gaseous Solvent

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US Patent:
6527164, Mar 4, 2003
Filed:
May 31, 2000
Appl. No.:
09/584128
Inventors:
Terri J. Brownfield - Boulder Creek CA
Jonathan D. Halderman - San Jose CA
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
B23K 2800
US Classification:
228201, 228205, 228206, 228219, 228 42, 219388, 219390, 134 11, 134 221
Abstract:
A method of cleaning residue on surfaces in a reflow furnace includes introducing a solvent into the furnace chamber; reacting the solvent with the residue to form a product; and, removing the product from the furnace chamber. The solvent is gaseous, such as an etch gas. Also, the product of the reaction between the residue and the solvent can is gaseous. The gaseous product can then be exhausted from the reflow furnace. A reflow furnace for practicing the method is also disclosed.

Method Of Preventing Residue Contamination Of Semiconductor Devices During Furnace Processing

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US Patent:
6536649, Mar 25, 2003
Filed:
Jul 28, 2000
Appl. No.:
09/627437
Inventors:
Raj N. Master - San Jose CA
Jonathan D. Halderman - San Jose CA
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
B23R 3704
US Classification:
228 495, 228 19, 228 42, 228206, 228205, 228102, 228103, 134 11, 219388, 219390
Abstract:
Residue contaminates semiconductor devices during processing in a furnace. Residue contamination is prevented by removing the residue before it builds up to a point where it can contaminate semiconductor devices. Residue build-up is monitored using a residue build-up monitoring device mounted on the furnace exhaust stack. When residue build-up reaches a predetermined level a signal is generated by the residue build-up monitoring device notifying technicians that furnace cleaning is required.

Determination Of Flux Coverage

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US Patent:
6597444, Jul 22, 2003
Filed:
Jul 28, 2000
Appl. No.:
09/627436
Inventors:
Jonathan D. Halderman - San Jose CA
Terri J. Brownfield - Boulder Creek CA
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
G01N 2100
US Classification:
3562371, 356630, 438 5, 438 7, 438 16, 22818022
Abstract:
A package assembly is formed by applying flux to a substrate and inspecting the applied flux to determine whether the amount applied is adequate to form reliable interconnections between a device and the substrate. Embodiments include applying a rosin based flux on a laminate substrate and inspecting the coverage of the applied flux by fluorescent spectroscopy.
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Jonathan D Halderman from Sunnyvale, CA, age ~52 Get Report