Search

Joseph E Scheffelin

from Poway, CA
Age ~67

Joseph Scheffelin Phones & Addresses

  • 13029 Pomard Way, Poway, CA 92064
  • Corvallis, OR
  • San Diego, CA

Publications

Us Patents

System And Method For Inducing Tensioning Of A Flexible Nozzle Member Of An Inkjet Printer With An Adhesive

View page
US Patent:
6334661, Jan 1, 2002
Filed:
Jul 2, 1999
Appl. No.:
09/347076
Inventors:
Steven W. Steinfield - San Diego CA
Joseph E. Scheffelin - Poway CA
William S. Colburn - San Diego CA
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
B41J 2145
US Classification:
347 20
Abstract:
This present invention is embodied in a printing system and method for inducing shrinkage-tensioning of a flexible nozzle member of a printhead portion of an inkjet printer with an adhesive and novel arrangement. The printing system of the present invention includes a nozzle member securely coupled to a printhead body with an adhesive arrangement that allows shrinkage-induce tensioning of the nozzle member. The adhesive arrangement includes having an adhesive located between a top portion of the printhead body and the flexible nozzle member. The top portion has a mechanical structure such that it induces tensioning of the flexible nozzle member during thermal expansion of the adhesive. Namely, the adhesive arrangement of the printing system of the present invention is capable of efficiently tensioning, and thus, flattening the flexible nozzle member during the adhesion process of the nozzle member. As a result, trajectory errors of ejected ink droplets from the nozzles are reduced.

Electrical Connection For Wide-Array Inkjet Printhead Assembly With Hybrid Carrier For Printhead Dies

View page
US Patent:
6341845, Jan 29, 2002
Filed:
Aug 25, 2000
Appl. No.:
09/648120
Inventors:
Joseph E. Scheffelin - Poway CA
Janis Horvath - San Diego CA
Brian J. Keefe - La Jolla CA
Lawrence H. White - Corvallis OR
Ali Emamjomeh - Duchess Crest, SG
Paul Mark Haines - Lebanon OR
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
B41J 2155
US Classification:
347 50, 347 42
Abstract:
A wide-array inkjet printhead assembly includes a carrier and a printhead die. The carrier includes a substrate and an electrical circuit. The substrate has a first side and a second side such that the electrical circuit is disposed on the second side of the substrate. The printhead die is mounted on the first side of the substrate and electrically coupled to the electrical circuit. Thus, electrical connection is established between the first side of the substrate and second side of the substrate.

Continuous Refill Of Spring Bag Reservoir In An Ink-Jet Swath Printer/Plotter

View page
US Patent:
6341853, Jan 29, 2002
Filed:
Apr 28, 1998
Appl. No.:
09/067659
Inventors:
Joseph E. Scheffelin - San Diego CA
Mark E. Young - Escondido CA
Elizabeth Zapata - San Diego CA
Kenneth J. Courian - San Diego CA
George T. Kaplinsky - San Diego CA
David W. Swanson - Escondido CA
James E. Clark - Albany OR
Tofigh Khodapanah - San Diego CA
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
B41J 2175
US Classification:
347 87
Abstract:
A closed ink replenishment system for replenishing the supply of ink in negative pressure spring-bag reservoirs in a printer/plotter. A tube runs between each cartridge reservoir and an auxiliary reservoir mounted to the printer/plotter frame to form the closed ink system. As ink is depleted from the spring-bag reservoir during printing operation, the negative pressure in the cartridge increases, drawing ink through the tube from the auxiliary reservoir into the cartridge until the negative pressure decreases to an equilibrium point. As a result, the volume of ink within the spring-bag reservoir remains substantially constant so long as there is ink remaining within the auxiliary reservoir. This maintains the print quality. The auxiliary reservoir is a flat bag mounted on a spring-biased platform, which acts as a height regulating system.

Carrier Positioning For Wide-Array Inkjet Printhead Assembly

View page
US Patent:
6350013, Feb 26, 2002
Filed:
Aug 25, 2000
Appl. No.:
09/648121
Inventors:
Joseph E. Scheffelin - Poway CA
Melissa D. Boyd - Corvallis OR
James W. Ring - Blodgett OR
Mohammad Akhavain - Escondido CA
Janis Horvath - San Diego CA
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
B41J 2155
US Classification:
347 49, 347 42
Abstract:
An inkjet printing system includes a mounting assembly and an inkjet printhead assembly. The mounting assembly includes a plurality of datums and the inkjet printhead assembly includes a carrier and a plurality of printhead dies each mounted on the carrier. The inkjet printhead assembly is mounted in the mounting assembly such that the carrier contacts at least one of the datums. Thus, positioning of the carrier relative to the mounting assembly is established.

Electrical Interconnection For Wide-Array Inkjet Printhead Assembly

View page
US Patent:
6394580, May 28, 2002
Filed:
Mar 20, 2001
Appl. No.:
09/812520
Inventors:
Joseph E. Scheffelin - Poway CA
Ernesto A. Garay - Gresham OR
Gerald Vincent Rapp - Escondido
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
B41J 2155
US Classification:
347 50, 347 42
Abstract:
A wide-array inkjet printhead assembly includes a carrier including a substructure and a substrate mounted on the substructure, a plurality of printhead dies each mounted on the substrate, and an electrical interconnect adapted to communicate electrical signals between an electronic controller and the inkjet printhead assembly. The substrate has an electrical circuit formed therein such that the printhead dies are electrically coupled to the electrical circuit and the electrical interconnect is electrically coupled to the electrical circuit. As such, the substructure accommodates the electrical interconnect.

Coplanar Mounting Of Printhead Dies For Wide-Array Inkjet Printhead Assembly

View page
US Patent:
6409307, Jun 25, 2002
Filed:
Feb 14, 2001
Appl. No.:
09/783676
Inventors:
Mohammad Akhavain - Escondido CA
Robert-Scott Melendrino Lopez - Escondido CA
Janis Horvath - San Diego CA
Noah Carl Lassar - San Diego CA
David McElfresh - San Diego CA
Brian J. Keefe - La Jolla CA
Joseph E. Scheffelin - Poway CA
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
B41J 2155
US Classification:
347 42, 347 13, 347 49
Abstract:
An inkjet printhead assembly includes a substrate having a non-planar surface and a plurality of adhesive quantities each disposed on the non-planar surface of the substrate. As such, a plurality of printhead dies are each adhered to the non-planar surface of the substrate by one of the adhesive quantities. A thickness of at least one of the adhesive quantities varies from the thickness of another of the adhesive quantities such that the thickness of the adhesive quantities compensates for the non-planar surface of the substrate. Thus, the adhesive quantities support the printhead dies and establish a substantially coplanar relationship among the printhead dies.

Reference Datums For Inkjet Printhead Assembly

View page
US Patent:
6428141, Aug 6, 2002
Filed:
Apr 23, 2001
Appl. No.:
09/840785
Inventors:
David K. Mc Elfresh - San Diego CA
Mohammad Akhavain - Escondido CA
Joseph E. Scheffelin - Poway CA
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
B41J 215
US Classification:
347 40, 347 42, 347 49, 347 13
Abstract:
A carrier adapted to support at least one printhead die includes a substrate having at least one surface and at least one datum attached to the at least one surface of the substrate. The substrate includes a first material and the at least one datum is formed from a blank including a second material. As such, the at least one datum is adapted to position the carrier in at least one dimension.

Hybrid Carrier For Wide-Array Inkjet Printhead Assembly

View page
US Patent:
6431683, Aug 13, 2002
Filed:
Mar 20, 2001
Appl. No.:
09/812737
Inventors:
May Fong Ho - Escondido CA
Joseph E. Scheffelin - Poway CA
Mohammad Akhavain - Escondido CA
Brian J. Keefe - La Jolla CA
Janis Horvath - San Diego CA
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
B41J 214
US Classification:
347 50, 347 58
Abstract:
A wide-array inkjet printhead assembly includes a carrier and a plurality of printhead dies each mounted on the carrier. The carrier includes a substructure and a substrate mounted on the substructure. The substrate includes a plurality of layers and has a plurality of conductive paths extending therethrough. As such, each of the printhead dies are mounted on the substrate and electrically coupled to at least one of the conductive paths of the substrate.
Joseph E Scheffelin from Poway, CA, age ~67 Get Report