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  • San Jose, CA

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Wiring Substrate For Electronic-Component Inspection Apparatus

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US Patent:
20090200067, Aug 13, 2009
Filed:
Feb 2, 2009
Appl. No.:
12/364174
Inventors:
Kazuya Nozu - San Jose CA, US
Assignee:
NGK SPARK PLUG CO., LTD. - Nagoya
International Classification:
H05K 1/03
US Classification:
174255
Abstract:
A wiring substrate K for an electronic-component inspection apparatus includes a substrate body () composed of a plurality of stacked ceramic layers s to s and having a front surface () and a back surface (); and front-surface terminal electrodes f formed on the front surface () of the substrate body (). Unit inspection patterns a, individual ones of which are constituted by a plurality of the front-surface terminal electrodes f disposed to correspond to a plurality of terminal electrodes m of a single electronic component cn to be inspected, are regularly disposed in vertical and horizontal directions as viewed from above such that the centroids g of the unit inspection patterns acoincide with alternate ones of intersections j between vertical imaginary lines L to L and horizontal imaginary lines N to N passing through the centroids g of the unit inspection patterns a
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