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Kirk M Slenes

from Albuquerque, NM
Age ~54
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Also known as:
Lisa Slenes, Sydney Slenes, Michael Slenes Kirk
Phone and address:
9404 Del Arroyo Ave, Albuquerque, NM 87122
(505) 797-4417
Related to:
Rebecca F Slenes, 40
Connected to:
Justin M Slenker, 36Brad SlennErica P Slep, 41Benjamin D Slepcevich, 49Florence W Slepian, 95Lisa G Slepian, 50Matthew A Slepian, 60Frank B Slepicka, 57James B Slepicka, 50John E Slepicka, 41

Kirk Slenes Phones & Addresses

  • 9404 Del Arroyo Ave, Albuquerque, NM 87122 (505) 797-4417
  • 6812 Lamar Ave, Albuquerque, NM 87120 (505) 890-0738
  • Seattle, WA
  • 1915 Parkwood Dr, Olympia, WA 98501 (360) 943-2925
  • Bernalillo, NM

Work

Company: Tpl Position: Vice president

Skills

Product Development • Product Management • Process Improvement • Engineering • Strategic Planning • Manufacturing • Cross Functional Team Leadership • Project Management

Industries

Electrical/Electronic Manufacturing

Resumes

Resumes

Kirk Slenes Photo 1

Vice President

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Location:
Albuquerque, NM
Industry:
Electrical/Electronic Manufacturing
Work:
Tpl
Vice President
Skills:
Product Development
Product Management
Process Improvement
Engineering
Strategic Planning
Manufacturing
Cross Functional Team Leadership
Project Management

Business Records

Name / Title
Company / Classification
Phones & Addresses
Kirk Slenes
Vice President
TPL, INC
Commercial Physical Research
3921 Academy Pkwy N Ne  , Albuquerque, NM 87109
3921 Academy Pkwy North NE, Albuquerque, NM 87109
(505) 342-4471, (505) 344-6744, (505) 343-1797

Publications

Us Patents

Dielectric Material Including Particulate Filler

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US Patent:
6608760, Aug 19, 2003
Filed:
Dec 9, 1999
Appl. No.:
09/458363
Inventors:
William F. Hartman - Albuquerque NM
Kirk M. Slenes - Albuquerque NM
Kristen J. Law - Albuquerque NM
Assignee:
TPL, Inc. - Albuquerque NM
International Classification:
H05K 116
US Classification:
361762, 361763
Abstract:
A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a T greater than 140Â C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from -55 to 125Â C.

Integral Capacitance For Printed Circuit Board Using Dielectric Nanopowders

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US Patent:
6616794, Sep 9, 2003
Filed:
May 4, 1999
Appl. No.:
09/305253
Inventors:
William F. Hartman - Albuquerque NM
Kirk M. Slenes - Albuquerque NM
Kristen J. Law - Scottsdale AZ
Assignee:
TPL, Inc. - Albuquerque
International Classification:
C04B 35468
US Classification:
1563069, 1563073, 501137, 361762, 361763
Abstract:
A method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of a very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture which is formed into a dielectric layer. The dielectric layer may be placed upon a conductive layer prior to curing, or conductive layers may be applied upon a cured dielectric layer, either by lamination or by metallization processes, such as vapor deposition or sputtering.

Cast Dielectric Composite Linear Accelerator

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US Patent:
7615942, Nov 10, 2009
Filed:
Nov 14, 2006
Appl. No.:
11/599797
Inventors:
David M. Sanders - Livermore CA, US
Stephen Sampayan - Manteca CA, US
Kirk Slenes - Albuquerque NM, US
H. M. Stoller - Albuquerque NM, US
Assignee:
Lawrence Livermore National Security, LLC - Livermore CA
TPL, Inc. - Albuquerque MN
International Classification:
H05H 9/00
US Classification:
315505, 315500, 156288
Abstract:
A linear accelerator having cast dielectric composite layers integrally formed with conductor electrodes in a solventless fabrication process, with the cast dielectric composite preferably having a nanoparticle filler in an organic polymer such as a thermosetting resin. By incorporating this cast dielectric composite the dielectric constant of critical insulating layers of the transmission lines of the accelerator are increased while simultaneously maintaining high dielectric strengths for the accelerator.

Definable Integrated Passives For Circuitry

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US Patent:
20020062924, May 30, 2002
Filed:
Nov 9, 2001
Appl. No.:
10/052863
Inventors:
William Hartman - Albuquerque NM, US
Kirk Slenes - Albuquerque NM, US
Kristen Law - Scottsdale AZ, US
International Classification:
B31C001/00
US Classification:
156/307300, 156/187000
Abstract:
A method of fabricating a passive integrated circuit. The integrated circuitry is fabricated in a single plane, the circuitry including passive components such as capacitors, resistors, and inductors. The method features the steps of forming on a substrate a first pattern of conductive material and a first set of passive component elements, and depositing a patterned dielectric layer onto the substrate. The first pattern of conductive material provides electrical connectivity to the first set of passive component elements. An apparatus fabricated according to method is disclosed

Dielectric Material Including Particulate Filler

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US Patent:
20040109298, Jun 10, 2004
Filed:
Aug 19, 2003
Appl. No.:
10/644386
Inventors:
William Hartman - Albuquerque NM, US
Kirk Slenes - Albuquerque NM, US
Kristen Law - Scottsdale AZ, US
International Classification:
C04B035/468
US Classification:
361/762000, 156/306900
Abstract:
A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a Tgreater than 140 C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from -55 to 125 C. Additionally, a method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture that is formed into a dielectric layer. The dielectric layer may be placed upon a conductive layer prior to curing, or conductive layers may be applied upon a cured dielectric layer, either by lamination or by metallization processes, such as vapor deposition or sputtering.

Structured Composite Dielectrics

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US Patent:
20060074164, Apr 6, 2006
Filed:
May 31, 2005
Appl. No.:
11/142515
Inventors:
Kirk Slenes - Albuquerque NM, US
Dale Perry - Albuquerque NM, US
Christopher Labanowski - Albuquerque NM, US
Hope Perry - Albuquerque NM, US
Erik Luther - Albuquerque NM, US
Assignee:
TPL, Inc. - Albuquerque NM
International Classification:
C08K 3/22
US Classification:
524413000
Abstract:
The present invention provides a structured, nano-composite, dielectric film. The invention also provides a method for producing the thin composite film. The composite material comprises ceramic dielectric particles, preferably nano-sized particles, and a thermoset polymer system. The composite material exhibits a high energy density.

Moldable High Dielectric Constant Nano-Composites

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US Patent:
20060074166, Apr 6, 2006
Filed:
Dec 20, 2004
Appl. No.:
11/019810
Inventors:
Kirk Slenes - Albuquerque NM, US
Christopher Labanowski - Albuquerque NM, US
Assignee:
TPL, Inc. title and interest in an application - Albuquerque NM
International Classification:
C08K 3/22
US Classification:
524436000
Abstract:
The present invention comprises the use of high dielectric constant composite materials comprising a high particle loading to form molded structures comprising three dimensional shapes. The composite material comprises ceramic dielectric particles, preferably nano-sized particles, and a thermoset polymer system. The composite material exhibits a high energy density.

Moldable High Dielectric Constant Nano-Composites

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US Patent:
20080128961, Jun 5, 2008
Filed:
Jan 23, 2008
Appl. No.:
12/018696
Inventors:
Kirk M. Slenes - Albuquerque NM, US
Christopher Labanowski - Albuquerque NM, US
Assignee:
TPL, INC. - Albuquerque NM
International Classification:
B28B 1/00
US Classification:
264642
Abstract:
The present invention comprises the use of high dielectric constant composite materials comprising a high particle loading to form molded structures comprising three dimensional shapes. The composite material comprises ceramic dielectric particles, preferably nano-sized particles, and a thermoset polymer system. The composite material exhibits a high energy density.
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Kirk M Slenes from Albuquerque, NM, age ~54 Get Report