Mathew Hannon

20120234807, Sep 20, 2012

Mar 16, 2012

13/422190

Jeffrey P. Sercel - Hollis NH, US
Marco Mendes - Manchester NH, US
Mathew Hannon - Bedford NH, US
Michael von Dadelszen - Merrimack NH, US

J.P. SERCEL ASSOCIATES INC. - Manchester NH

B23K 26/38

21912169, 21912168

Systems and methods for laser scribing provide extended depth affectation into a substrate or workpiece by focusing a laser beam such that the beam passes into the workpiece using a waveguide, self-focusing effect to cause internal crystal damage along a channel extending into the workpiece. Different optical effects may be used to facilitate the waveguide, self-focusing effect, such as multi-photon absorption in the material of the workpiece, transparency of the material of the workpiece, and aberrations of the focused laser. The laser beam may have a wavelength, pulse duration, and pulse energy, for example, to provide transmission through the material and multi-photon absorption in the material. An aberrated, focused laser beam may also be used to provide a longitudinal spherical aberration range sufficient to extend the effective depth of field (DOF) into the workpiece.

20050230260, Oct 20, 2005

Feb 4, 2005

11/051521

Martin Bleck - Albuquerque NM, US
Robert Berner - Kalispell MT, US
Gerard Minogue - Rio Rancho NM, US
Fernando Sanchez - Albuquerque NM, US
Mathew Hannon - Albuquerque NM, US
Thomas Griego - Corrales NM, US

Surfect Technologies, Inc. - Albuquerque NM

C25D005/00
C25D017/00

205088000, 204242000

The present invention comprises a metal plating apparatus and method, particularly suitable for autocatalytic (i.e., electroless) plating, comprising a pressurized sealable vessel for disposing a substrate to be plated and for the circulation of plating solutions wherein temperatures and pressure are highly controllable.

20210300011, Sep 30, 2021

Apr 12, 2021

17/228082

- Oxford MA, US
Mathew Hannon - Bedford NH, US
Marco Mendes - Manchester NH, US
Jeffrey P. Sercel - Hollis NH, US

B32B 43/00
B23K 26/50
B23K 26/40

Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material.

20210094127, Apr 1, 2021

Oct 19, 2020

17/074489

- Oxford MA, US
Marco Mendes - Manchester NH, US
Rouzbeh Sarrafi - Fremont NH, US
Joshua Schoenly - Nashua NH, US
Xiangyang Song - Acton MA, US
Mathew Hannon - Bedford NH, US
Miroslaw Sokol - Bedford NH, US

B23K 26/402
B23K 26/38
B23K 26/06
B23K 26/0622
B23K 26/08
B23K 26/361
B23K 26/082
B23K 26/70
C03B 33/02

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

20190314934, Oct 17, 2019

May 24, 2019

16/422558

- Oxford MA, US
Marco Mendes - Manchester NH, US
Rouzbeh Sarrafi - Fremont NH, US
Joshua Schoenly - Nashua NH, US
Xiangyang Song - Acton MA, US
Mathew Hannon - Bedford NH, US
Miroslaw Sokol - Bedford NH, US

B23K 26/361
B23K 26/38
B23K 26/402
B23K 26/08

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

20180001425, Jan 4, 2018

Sep 19, 2017

15/708628

- Oxford MA, US
Marco MENDES - Manchester NH, US
Rouzbeh SARRAFI - Fremont NH, US
Joshua SCHOENLY - Nashua NH, US
Xiangyang SONG - Acton MA, US
Mathew HANNON - Bedford NH, US
Miroslaw SOKOL - Bedford NH, US

B23K 26/402
B23K 26/70
C03B 33/02
B23K 26/38
B23K 103/00

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

20170266946, Sep 21, 2017

Jun 5, 2017

15/613768

- Oxford MA, US
Mathew HANNON - Bedford NH, US
Marco MENDES - Manchester NH, US
Jeffrey P. SERCEL - Hollis NH, US

B32B 43/00
B23K 26/40
B23K 26/00

Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material.

20160059349, Mar 3, 2016

Aug 28, 2015

14/838809

- Oxford MA, US
Marco MENDES - Manchester NH, US
Rouzbeh SARRAFI - Fremont NH, US
Joshua SCHOENLY - Nashua NH, US
Xiangyang SONG - Acton MA, US
Mathew HANNON - Bedford NH, US
Miroslaw SOKOL - Bedford NH, US

B23K 26/06
B23K 26/361
C03B 33/10
B23K 26/14
C03B 33/023
B23K 26/38
B23K 26/402

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).