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Michael Renn Phones & Addresses

  • Saint Paul, MN
  • Minneapolis, MN
  • Albertville, MN
  • Watertown, MN

Professional Records

License Records

Michael S Renn

License #:
2500 - Active
Category:
Mental Health Practice
Issued Date:
Jan 13, 2003
Effective Date:
Jan 13, 2003
Expiration Date:
Sep 1, 2018
Type:
Mental Health Practitioner

Michael S Renn

License #:
1359 - Expired
Category:
Mental Health Practice
Issued Date:
Jan 13, 2003
Effective Date:
Sep 12, 2016
Expiration Date:
Sep 1, 2016
Type:
Professional Counselor

Michael S Renn

License #:
6985 - Expired
Category:
Mental Health Practice
Issued Date:
Dec 28, 2001
Effective Date:
Jan 13, 2003
Expiration Date:
Dec 28, 2006
Type:
Provisional Mental Health Practitioner

Michael S Renn

License #:
92 - Expired
Category:
Psychology
Issued Date:
Jan 11, 2002
Effective Date:
Jan 13, 2003
Expiration Date:
Jan 11, 2007
Type:
Supervisory PLMHP Registration

Resumes

Resumes

Michael Renn Photo 1

Michael Renn

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Michael Renn Photo 2

Michael Renn

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Location:
Greater Minneapolis-St. Paul Area
Industry:
Nanotechnology

Publications

Us Patents

Particle Guidance System

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US Patent:
6636676, Oct 21, 2003
Filed:
Jun 1, 2000
Appl. No.:
09/584997
Inventors:
Michael J. Renn - Hudson WI
Assignee:
Optomec Design Company - Albuquerque NM
International Classification:
G02B 602
US Classification:
385125, 385147, 385 11
Abstract:
Methods and apparatus are disclosed for using a beam of energy, specifically laser light ( ), to transport, suspend or trap non-atomic size particles ( ) within a hollow-core optical fiber ( ), manipulating the particles ( ) along the fiber ( ) over distances and depositing them on a substrate ( ). A laser generates a beam ( ) focused on a fiber ( ) entrance ( ). A source ( ) delivers particles ( ) to the entrance ( ). Particles ( ) are drawn into the beam ( ) and propelled through the core ( ) of the fiber ( ). Forces (F -F ) on a particle ( ) generated by reflection, absorption and refraction of laser light ( ) keep the particle ( ) close to the fibers center and propel it along the fibers length. A variety of micron-size particles, including solids, solid dielectrics, semiconductors, liquids, aerosols and living cells are conveyed. The invention is adapted to direct-writing of micron-sized features ( ) on surfaces, for example, microcircuits and microcircuit components for âsmartâ credit cards and biological implants, to recording emission spectra of trapped particles and to many other such uses.

Apparatuses And Method For Maskless Mesoscale Material Deposition

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US Patent:
7045015, May 16, 2006
Filed:
Jan 17, 2003
Appl. No.:
10/346935
Inventors:
Michael J. Renn - Hudson WI, US
Bruce H. King - Albuquerque NM, US
Marcelino Essien - Cedar Crest NM, US
Lemna J. Hunter - Corrales NM, US
Assignee:
Optomec Design Company - Albuquerque NM
International Classification:
B05C 11/06
US Classification:
118686, 118 62, 118 63, 118500
Abstract:
Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100 C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.

Direct Write™ System

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US Patent:
7270844, Sep 18, 2007
Filed:
Sep 20, 2004
Appl. No.:
10/945416
Inventors:
Michael J. Renn - Hudson WI, US
Assignee:
Optomec Design Company - Albuquerque NM
International Classification:
B05D 5/12
B05D 3/02
C23C 18/00
US Classification:
427 58, 427120, 427124, 4271261, 427117, 427101, 427 967, 4273831, 427384, 4274274
Abstract:
Methods and apparatus for the deposition of a source material () are disclosed. An atomizer () renders a supply of source material () into many discrete particles. A force applicator () propels the particles in continuous, parallel streams of discrete particles. A collimator () controls the direction of flight of the particles in the stream prior to their deposition on a substrate (). In an alternative embodiment of the invention, the viscosity of the particles may be controlled to enable complex depositions of non-conformal or three-dimensional surfaces. The invention also includes a wide variety of substrate treatments which may occur before, during or after deposition. In yet another embodiment of the invention, a virtual or cascade impactor may be employed to remove selected particles from the deposition stream.

Laser Processing For Heat-Sensitive Mesoscale Deposition

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US Patent:
7294366, Nov 13, 2007
Filed:
Sep 27, 2004
Appl. No.:
10/952108
Inventors:
Michael J. Renn - Hudson WI, US
Bruce H. King - Albuquerque NM, US
Marcelino Essien - Cedar Crest NM, US
Manampathy G. Giridharan - Mason OH, US
Jyh-Cherng Sheu - Hsinchu, TW
Assignee:
Optomec Design Company - Albuquerque NM
International Classification:
B05D 3/06
US Classification:
427554, 427226, 4273722, 427596
Abstract:
A method of depositing various materials onto heat-sensitive targets. Heat-sensitive targets are generally defined as targets that have thermal damage thresholds that are lower than the temperature required to process a deposited material. The invention uses precursor solutions and/or particle or colloidal suspensions, along with optional pre-deposition treatment and/or post-deposition treatment to lower the laser power required to drive the deposit to its final state. The present invention uses Maskless Mesoscale Material Deposition (MD™) to perform direct deposition of material onto the target in a precise, highly localized fashion. Features with linewidths as small as 4 microns may be deposited, with little or no material waste. A laser is preferably used to heat the material to process it to obtain the desired state, for example by chemical decomposition, sintering, polymerization, and the like. This laser processing may be performed in an ambient environment with laser powers of less than 100 milliwatts.

Apparatuses And Methods For Maskless Mesoscale Material Deposition

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US Patent:
7485345, Feb 3, 2009
Filed:
Dec 22, 2005
Appl. No.:
11/317457
Inventors:
Michael J. Renn - Hudson WI, US
Bruce H. King - Albuquerque NM, US
Marcelino Essien - Cedar Crest NM, US
Gregory J. Marquez - Albuquerque NM, US
Manampathy G. Giridharan - Mason OH, US
Jyh-Cherng Sheu - Hsinchu, TW
Assignee:
Optomec Design Company - Albuquerque NM
International Classification:
B05D 5/00
US Classification:
4274211, 4274274, 427101, 427384
Abstract:
Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100 C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.

Direct Write# System

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US Patent:
7658163, Feb 9, 2010
Filed:
Jul 20, 2006
Appl. No.:
11/458966
Inventors:
Michael J. Renn - Hudson WI, US
Bruce H. King - Albuquerque NM, US
Manampathy G. Giridharan - Mason OH, US
Jyh-Cherng Sheu - Hsinchu, TW
Assignee:
Optomec Design Company - Albuquerque NM
International Classification:
B05C 19/00
B05B 5/03
B05B 1/28
B05B 5/00
US Classification:
118308, 118621, 118641, 118300, 118 62, 239296
Abstract:
Methods and apparatus for the deposition of a source material () are disclosed. An atomizer () renders a supply of source material () into many discrete particles. A force applicator () propels the particles in continuous, parallel streams of discrete particles. A collimator () controls the direction of flight of the particles in the stream prior to their deposition on a substrate (). In an alternative embodiment of the invention, the viscosity of the particles may be controlled to enable complex depositions of non-conformal or three-dimensional surfaces. The invention also includes a wide variety of substrate treatments which may occur before, during or after deposition. In yet another embodiment of the invention, a virtual or cascade impactor may be employed to remove selected particles from the deposition stream.

Aerodynamic Jetting Of Aerosolized Fluids For Fabrication Of Passive Structures

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US Patent:
7674671, Mar 9, 2010
Filed:
Dec 12, 2005
Appl. No.:
11/302481
Inventors:
Michael J. Renn - Hudson WI, US
Marcelino Essien - Cedar Crest NM, US
Bruce H. King - Albuquerque NM, US
Jason A. Paulsen - Centerville MN, US
Assignee:
Optomec Design Company - Albuquerque NM
International Classification:
H01L 21/8234
US Classification:
438238, 438382, 438763, 438782
Abstract:
Method and apparatus for direct writing of passive structures having a tolerance of 5% or less in one or more physical, electrical, chemical, or optical properties. The present apparatus is capable of extended deposition times. The apparatus may be configured for unassisted operation and uses sensors and feedback loops to detect physical characteristics of the system to identify and maintain optimum process parameters.

Apparatuses And Methods For Maskless Mesoscale Material Deposition

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US Patent:
7987813, Aug 2, 2011
Filed:
Jan 6, 2009
Appl. No.:
12/349279
Inventors:
Michael J. Renn - Hudson WI, US
Bruce H. King - Albuquerque NM, US
Marcelino Essien - Cedar Crest NM, US
Gregory J. Marquez - Albuquerque NM, US
Manampathy G. Giridharan - Mason OH, US
Jyh-Cherng Sheu - Hsinchu, TW
Assignee:
Optomec, Inc. - Albuquerque NM
International Classification:
B05C 11/00
B05C 11/06
B05B 1/08
B05B 5/00
US Classification:
118686, 118 62, 118 63, 118500, 118641, 118642, 2391022, 239338
Abstract:
Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100 C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.
Michael W Renn from Saint Paul, MN Get Report