US Patent:
20220326591, Oct 13, 2022
Inventors:
- Redmond WA, US
Rhishikesh A. SATHE - Bothell WA, US
Andrew D. DELANO - Woodinville WA, US
International Classification:
G03B 17/55
G03B 17/56
H05K 7/20
H04N 5/225
Abstract:
Embodiments enable an accessory device coupled to a parent device to transfer heat directly to the parent device via convection thereby enabling the parent device to help cool the accessory device. The electronic device includes a device body housing coupled to and housing a heat-generating component, a device foot coupled to an exterior surface of the device body housing and a first mating element. The parent device includes a planar mounting surface, and a second mating element adapted to engage with the first mating element of the accessory device to mount the accessory device to the parent device, and brings the planar portion of the device foot housing into contact with the planar mounting surface. The heat-generating component is thermally coupled to the parent device via a thermal circuit comprising the device body house, the device foot, the planar portion thereof, and the planar mounting surface of the parent device.