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Shriya Kumar Phones & Addresses

  • New York, NY
  • White Plains, NY
  • Chicago, IL
  • State College, PA

Work

Company: Office of technology management, university of illinois chicago (uic) Aug 2013 Position: Intellectual property intern

Education

School / High School: IIT- Chicago Kent College of Law- Chicago, IL 2013 Specialities: MS in Intellectual Property Management

Skills

Patent Analytics • Patent Valuation • Patentability analysis • Prior Art Searches • Licensing

Resumes

Resumes

Shriya Kumar Photo 1

Business Development

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Location:
New York, NY
Industry:
Hospital & Health Care
Work:
Ibm
Client Success Manager

Ibm Jul 2014 - Oct 2017
Ip Business Development

University of Illinois at Chicago May 2013 - Jul 2014
Business Development Consultant

National University of Singapore Nov 2011 - May 2013
Research Associate

Keystone Nano, Inc. Jun 2010 - Dec 2010
Research Intern
Education:
Chicago - Kent College of Law, Illinois Institute of Technology 2013 - 2014
Master of Science, Masters, Management
Penn State University 2009 - 2010
Master of Science, Masters, Biotechnology
Sathyabama Institute of Science and Technology 2005 - 2009
Bachelors, Bachelor of Technology, Biotechnology
Skills:
Project Management
Patent Law
Project Planning
Risk Management
Customer Relationship Management
Financial Reporting
Change Management
Artificial Intelligence
Information Technology
Customer Satisfaction
Microsoft Project
Microsoft Excel
Microsoft Powerpoint
Software As A Service
Client Relations
Public Speaking
Client Liaison
Management
Leadership
Cross Functional Team Leadership
Trusted Business Partner
Data Science
Patent Portfolio Analysis
Intellectual Property Valuation
Customer Success
Saas
Enterprise Software
Salesforce
Account Management
Enterprise Account Management
Machine Learning
Biotechnology
Patents
Data Analysis
Patent Licensing
Quality Management System
Market Research
Microsoft Word
Sales
Business Strategy
Patent Landscape Analysis
Intellectual Property
Contract Negotiating
Interests:
Human Rights
Science and Technology
Education
Poverty Alleviation
Languages:
English
Tamil
Hindi
Certifications:
Plateau
Project Management Professional (Pmp)
Blockchain Essentials
Shriya Kumar Photo 2

Shriya Kumar

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Shriya Kumar Photo 3

Shriya Kumar

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Location:
New York, NY
Education:
Western New England University 2018 - 2020
Master of Business Administration, Masters
Shriya Kumar Photo 4

Shriya Kumar Chicago, IL

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Work:
Office of Technology Management, University of Illinois Chicago (UIC)

Aug 2013 to 2000
Intellectual Property Intern

National University of Singapore
Singapore
Nov 2011 to Apr 2013
Research Associate

Keystone Nano Inc

Jun 2010 to Dec 2010
Intern Researcher/Scientist

Proteomics and Mass Spectrometry Core Facility
University Park, PA
Sep 2009 to May 2010
Research Assistant

M S Swaminathan Research Foundation
Chennai, Tamil Nadu
Nov 2008 to Apr 2009
Research Intern

Biocon Limited
Bangalore, Karnataka
Dec 2006 to Feb 2007
Research Intern

Education:
IIT- Chicago Kent College of Law
Chicago, IL
2013 to 2014
MS in Intellectual Property Management

Pennsylvania State University
Dec 2010
MS in Biotechnology

Sathyabama University
May 2009
B.Tech in Biotechnology

Skills:
Patent Analytics, Patent Valuation, Patentability analysis, Prior Art Searches, Licensing

Publications

Us Patents

Medical Asset Sensing And Tracking

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US Patent:
20180096179, Apr 5, 2018
Filed:
Oct 5, 2016
Appl. No.:
15/285857
Inventors:
- Armonk NY, US
LI-WEN HUNG - Mahopac NY, US
JOHN U. KNICKERBOCKER - Yorktown Heights NY, US
SHRIYA KUMAR - Yorktown Heights NY, US
DUIXIAN LIU - Scarsdale NY, US
ENRIQUE VARGAS - Bronx NY, US
International Classification:
G06K 7/10
Abstract:
Embodiments include systems, methods, and computer program products for tracking and sensing medical assets. Systems include a plurality of long range transmitters. Systems also include a medical asset box including a medical asset, a radio frequency ID microchip in proximity to the medical asset, and an extended antenna that is capable of receiving a signal from the radio frequency ID microchip and transmitting the signal to an external device.

Via And Trench Filling Using Injection Molded Soldering

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US Patent:
20180000412, Jan 4, 2018
Filed:
Jul 20, 2016
Appl. No.:
15/214942
Inventors:
- Armonk NY, US
Shriya Kumar - New York NY, US
Jae-Woong Nah - Closter NJ, US
International Classification:
A61B 5/00
B23K 3/06
A61M 5/00
B23K 101/36
Abstract:
A method includes forming one or more trenches in a first substrate, forming one or more vias in a second substrate, aligning at least a first trench in the first substrate with at least a first via in the second substrate, and sealing the first substrate to the second substrate by filling the first via and the first trench with solder material using injection molded soldering.

Via And Trench Filling Using Injection Molded Soldering

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US Patent:
20180005879, Jan 4, 2018
Filed:
Jun 29, 2016
Appl. No.:
15/196558
Inventors:
- Armonk NY, US
Shriya Kumar - New York NY, US
Jae-Woong Nah - Closter NJ, US
International Classification:
H01L 21/768
H01L 23/498
H01L 23/15
H01L 23/532
Abstract:
A method includes forming one or more vias in a substrate, forming at least one liner on at least one sidewall of at least one of the vias, and filling said at least one via with solder material using injection molded soldering. The at least one liner may comprise a solder adhesion layer, a barrier layer, or a combination of a barrier layer and a solder adhesion layer.

Via And Trench Filling Using Injection Molded Soldering

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US Patent:
20180005932, Jan 4, 2018
Filed:
Jun 1, 2017
Appl. No.:
15/610885
Inventors:
- Armonk NY, US
Shriya Kumar - New York NY, US
Jae-Woong Nah - Closter NJ, US
International Classification:
H01L 23/498
H01L 21/48
H05K 1/03
Abstract:
A method includes forming one or more vias in a substrate, forming a first photoresist layer on a top surface of the substrate and a second photoresist layer on a bottom surface of the substrate, patterning the first photoresist layer and the second photoresist layer to remove at least a first portion of the first photoresist layer and at least a second portion of the second photoresist layer, filling the one or more vias, the first portion and the second portion with solder material using injection molded soldering, and removing remaining portions of the first photoresist layer and the second photoresist layer.

Via And Trench Filling Using Injection Molded Soldering

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US Patent:
20180005982, Jan 4, 2018
Filed:
Jun 2, 2017
Appl. No.:
15/612190
Inventors:
- Armonk NY, US
Shriya Kumar - New York NY, US
Jae-Woong Nah - Closter NJ, US
International Classification:
H01L 23/00
H01L 23/498
Abstract:
A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.

Wearable Sensor Monitoring And Data Analysis

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US Patent:
20170189751, Jul 6, 2017
Filed:
Dec 31, 2015
Appl. No.:
14/985485
Inventors:
- Armonk NY, US
Shriya Kumar - White Plains NY, US
Kang-Wook Lee - Yorktown Heights NY, US
Minhua Lu - Mohegan Lake NY, US
International Classification:
A63B 24/00
A61B 5/11
G09B 19/00
Abstract:
Systems and methods for monitoring body mounted/implanted sensors in combination with environmental sensors and sensors attached to person's medical/sports equipment. Data indicating a plurality of measured quantities associated with movement of a person at a time point is received. Each measured quantity within the plurality of measured quantities having been determined by a respective sensor attached to a respective location on the person or the person's environment or the person's medical/sports equipment. At least one characteristic of the person associated with the time point is determined based on analyzing the plurality of measured quantities. The at least one characteristic is stored. Recommendations for the person are determined based upon the characteristics, and a report comprising the recommendations is provided.
Shriya Kumar from New York, NY, age ~36 Get Report