Robert J. Farquharson - Atlantic Highlands NJ
Stanton T. Gerns - Cedar Knolls NJ
AT&T Information Systems - Holmdel NJ
AT&T Bell Laboratories - Murray Hill NJ
A new soldering technique is being employed whereby solder is formed into pads, each pad connected to the next pad by a solder link. The pads are formed on center spacings equal to the spaces between assembly board terminals and heated to the melting point of the solder whereupon surface tension of the solder collapses the interconnecting pad links thereby leaving the terminals electrically isolated. The solder pad assembly is made by an etching process.