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Steven L Dutton

from Oak Creek, WI
Age ~61
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Also known as:
Steven Lee Dutton, Steve L Dutton, Steven L Dulton, Elmo Dfg
Related to:
Nancy DuttonKristen M Dutton, 26John P Balnis, 68Sarah Dutton, 33Kathy J Dutton, 66Jennifer L Reisner, 41Steven K Balnis, 38Kathy J BalinisBarbara A Balnis, 75Dorna S Mcbride, 58
Connected to:
Ananda Dutton, 54Brianna J Dutton, 37Chad M Dutton, 49Clarissa Dutton, 32Gordon R Dutton, 55Haley R Dutton, 31Helen J Dutton, 68Jay R Dutton, 49Jonathon A Dutton, 27Kerry W Dutton, 55

Steven Dutton Phones & Addresses

  • Oak Creek, WI
  • 1801 E South Fork Dr, Phoenix, AZ 85048 (480) 460-7260 (480) 460-0021 (480) 460-1156
  • 1633 Pine Cone Way, Prescott, AZ 86303 (928) 776-9505
  • Argyle, TX
  • Tempe, AZ

Work

Company: Nordstrom - last chance Jun 2008 Position: Shipping & receiving associate

Education

School / High School: Universal Technical Institute- Houston, TX Jul 2005 Specialities: Certificate in Collision Repair and Refinish Technology

Resumes

Resumes

Steven Dutton Photo 1

Steven Dutton

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Steven Dutton Photo 2

Steven Dutton Mesa, AZ

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Work:
Nordstrom - Last Chance

Jun 2008 to 2000
Shipping & Receiving Associate
Grand Prix Auto Body
Phoenix, AZ
Apr 2004 to Jul 2004
Body Shop Assistant
Education:
Universal Technical Institute
Houston, TX
Jul 2005
Certificate in Collision Repair and Refinish Technology
Maryvale High School
Phoenix, AZ
Aug 2001 to May 2004
Diploma
Metro Tech
Phoenix, AZ
2003 to 2004
Technology in Auto Body / Repair and Refinish

Business Records

Name / Title
Company / Classification
Phones & Addresses
Steven L. Dutton
WHIRLWIND TECHNOLOGIES, LLC
Mfg Semiconductors/Related Devices
1801 E South Frk Dr, Phoenix, AZ 85048
Steven M Dutton
NORTHERN MERIDIAN ENTERPRISES, LTD
Steven L. Dutton
President
Dynaco Acquisition Corp
Mfg Printed Circuit Boards
1501 W Shady Grv Rd, Grand Prairie, TX 75050
3020 S Park Dr, Tempe, AZ 85282
(602) 437-8003, (480) 968-2000
Steven Dutton
President
DYNACO CORP
1801 E South Frk Dr, Phoenix, AZ 85048
350 N St Paul St Team 1, Dallas, TX 75201
Steven L Dutton
Chief executive officer
ARIZONA CHEMCOAT CORPORATION
1801 E South Frk Dr, Phoenix, AZ 85048
Steven L Dutton
P3 SYSTEMS, LLC
Business Services
2901 N Central Ave #800, Phoenix, AZ 85012
1801 E South Frk Dr, Phoenix, AZ 85048
Steven L. Dutton
Principal
Steven L and Kathy J Dutton
Business Services at Non-Commercial Site
4106 E San Gabriel Ave, Phoenix, AZ 85044
Steven L Dutton
President/ceo, M
VECTRAONE TECHNOLOGIES INC
Nonclassifiable Establishments
1801 E South Frk Dr, Phoenix, AZ 85048

Publications

Us Patents

Method And Apparatus For Forming Multi-Layered Circuits Using Liquid Crystalline Polymers

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US Patent:
7290326, Nov 6, 2007
Filed:
Jul 22, 2005
Appl. No.:
11/187220
Inventors:
Steven Lee Dutton - Phoenix AZ, US
Assignee:
Dynaco Corp. - Tempe AZ
International Classification:
B23P 19/00
US Classification:
29738, 29739, 29830
Abstract:
A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

Printed Circuits And Method For Making Same

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US Patent:
7754417, Jul 13, 2010
Filed:
May 21, 2007
Appl. No.:
11/751350
Inventors:
Steven Lee Dutton - Phoenix AZ, US
International Classification:
G03F 7/00
G03F 7/40
US Classification:
430331, 430311, 430325, 430329, 430330
Abstract:
A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing imaging, developing and etching subtractive techniques in conventional printed circuit board processing.

Direct Emulsion Process For Making Printed Circuits

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US Patent:
8293461, Oct 23, 2012
Filed:
Jun 18, 2008
Appl. No.:
12/141662
Inventors:
Steven Lee Dutton - Phoenix AZ, US
Assignee:
VectraOne Technologies, LLC - Phoenix AZ
International Classification:
G03F 7/00
G03F 7/40
US Classification:
430331, 430311, 430324, 430325, 430329, 430330
Abstract:
A direct emulsion process for making printed circuits and printed circuit boards which includes coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate, imaging the coated substrate with a circuit design, developing the imaged substrate, and directly plating the developed image onto the coated substrate. Coating solutions which work particularly well in this process include a ferric oxalate and palladium emulsion or a silver based emulsion.

Printed Circuits And Method For Making Same

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US Patent:
8313891, Nov 20, 2012
Filed:
Jul 12, 2010
Appl. No.:
12/834433
Inventors:
Steven Lee Dutton - Phoenix AZ, US
Assignee:
VectraOne Technologies, LLC - Phoenix AZ
International Classification:
G03F 7/00
G03F 7/40
US Classification:
430331, 430311, 430325, 430329, 430330
Abstract:
A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing imaging, developing and etching subtractive techniques in conventional printed circuit board processing. One exemplary embodiment of the method for making printed circuit boards includes coating a non-metallized substrate with a palladium based material including a ferric based solution combined with palladium.

Process For Making High Count Multi-Layered Circuits

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US Patent:
20070107837, May 17, 2007
Filed:
Nov 6, 2006
Appl. No.:
11/593808
Inventors:
Steven Dutton - Phoenix AZ, US
International Classification:
B29C 65/00
US Classification:
156285000, 156182000
Abstract:
A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

Method And Apparatus For Forming Multi-Layered Circuits Using Liquid Crystalline Polymers

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US Patent:
20070234560, Oct 11, 2007
Filed:
May 15, 2007
Appl. No.:
11/749100
Inventors:
Steven Dutton - Phoenix AZ, US
International Classification:
H05K 3/36
H05K 1/00
US Classification:
029830000, 174250000, 029744000, 029739000
Abstract:
A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

Method And Apparatus For Forming Multi-Layered Circuits Using Liquid Crystalline Polymers

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US Patent:
20070234562, Oct 11, 2007
Filed:
May 15, 2007
Appl. No.:
11/749102
Inventors:
Steven Dutton - Phoenix AZ, US
International Classification:
H05K 3/36
C04B 37/00
US Classification:
029839000, 156089230, 174250000, 029852000, 029831000
Abstract:
A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

Method For Metallizing Liquid Crystal And Polymer

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US Patent:
20080292784, Nov 27, 2008
Filed:
May 19, 2008
Appl. No.:
12/123323
Inventors:
Steven Lee Dutton - Phoenix AZ, US
International Classification:
B05D 5/12
US Classification:
427 989
Abstract:
A method for making printed circuits and printed circuit boards which utilizes a process for forming a thin metal layer, such as a copper layer, on underlying substrates such as a liquid crystalline polymer material. Forming such a thin metal layer on the surface of the substrate enables fine line imaging for forming printed circuits and printed circuit boards. The process includes providing a metallized substrate, removing the metal from the substrate, vacuum baking the substrate, dipping the substrate in permanganate solution, rinsing the substrate with water, neutralizing the substrate, subjecting the substrate to an electroless copper procedure and plating the substrate with copper.
Control profile
Steven L Dutton from Oak Creek, WI, age ~61 Get Report