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Terry Michael Lambright

from Corvallis, OR
Age ~73
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Also known as:
Terry M Lambright, Terry L Lambright
Phone and address:
7175 Somerset Dr, Corvallis, OR 97330
(541) 990-4002
Related to:
Barbara L Lambright, 71Jamie E Lambright, 43Ruby E LambrightMelissa J Wilson, 45Michael R Wilson, 74Brooke K Wilson, 43Helen H Veazie, 97Jessica Wilson, 32James F LambrightBryce R Wilson, 47Bryce R Wilson, 46Helene H Veazie, 96Helene V Lambright, 73
Connected to:
Amanda L Lambright, 48Ellen A Lambright, 74Melanie L Lambright, 33Mikka L Lambright, 41Jorge J Lambrinos, 79Vanessa E Lambrinos, 46John D Lambris, 69Tom E Lambro, 71Alex Lambros, 92Alexandra M Lambros, 34

Terry Lambright Phones & Addresses

  • 7175 Somerset Dr, Corvallis, OR 97330 (541) 990-4002
  • Richland, WA
  • Bandon, OR
  • 7175 NW Somerset Dr, Corvallis, OR 97330

Resumes

Resumes

Terry Lambright Photo 1

Product Engineer At Hewlett-Packard

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Position:
Product Engineer at Hewlett-Packard (with CDI)
Location:
Corvallis, Oregon Area
Industry:
Electrical/Electronic Manufacturing
Work:
Hewlett-Packard (with CDI) - Corvallis, Oregon Area since Apr 2012
Product Engineer
ImTech Technologies LLC - Corvallis, Oregon Area Jun 2007 - Feb 2012
Materials & Process Development
Hewlett-Packard - Corvallis, Oregon Area Aug 1984 - May 2007
Sr. Member of Technical Staff
Sandvik Special Metals LLC - Kennewick, WA Aug 1981 - Jul 1984
Titanium Process Development Engineer
Education:
University of Arizona 1969 - 1976
M.S., Metallurgy and Materials Science
Terry Lambright Photo 2

Terry Lambright

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Location:
United States

Publications

Us Patents

Self-Aligned Interconnect And Method For Producing Same

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US Patent:
6457811, Oct 1, 2002
Filed:
Apr 30, 2001
Appl. No.:
09/843833
Inventors:
Alfred I-Tsung Pan - Sunnyvale CA
Terry M. Lambright - Corvallis OR
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
B41J 214
US Classification:
347 50, 347 49
Abstract:
A self-aligned interconnect significantly reduces manufacturing costs and provides important advantages in a number of specific applications begins with a single crystal substrate. The substrate is machined to accept microelectronic chips at various locations (openings) along the substrate. Corresponding chips are constructed to precisely fit the openings in the crystal substrate. To ensure precision fit, both the substrate and the chip are etched along the same crystal plane. As a result, the chips can be placed in the openings in the substrate with perfect or nearly perfect alignment in the x and y directions without expensive alignment tools. In effect, the chips and the substrate are self aligned.

Rapid Prototyping Material Systems

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US Patent:
6742456, Jun 1, 2004
Filed:
Nov 14, 2002
Appl. No.:
10/295132
Inventors:
Vladek Kasperchik - Corvallis OR
Terry M. Lambright - Corvallis OR
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B41F 132
US Classification:
101483, 1014011, 264308, 264DIG 72, 1061629, 156305
Abstract:
A rapid prototyping system preferably includes a basic component in powder form selected from the group consisting of a metal oxide, and one or more aluminosilicate glasses; an acidic component (polymeric, oligomeric or polymerizable low molecular weight acid or hydrolyzable acidic metal salt); and an aqueous binder capable of stimulating a crosslinking reaction between the basic component and the acidic component to form a three-dimensional printed object.

Fluid-Ejection Assembly

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US Patent:
6877840, Apr 12, 2005
Filed:
Apr 30, 2003
Appl. No.:
10/427167
Inventors:
Christopher Vitello - Corvallis OR, US
Silam J. Choy - Corvallis OR, US
Terry M. Lambright - Corvallis OR, US
Mark D. Tucker - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B41J002/14
B41J002/16
US Classification:
347 50
Abstract:
A fluid-ejection assembly that includes a substantially-rigid substrate and an ejection head configured to be positioned in a fixed relationship relative to the substantially-rigid substrate. The ejection head is configured to eject a fluid based on an ejection signal received via a conductive pattern defined on the substrate.

Fluid Ejection Device Adherence

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US Patent:
6902260, Jun 7, 2005
Filed:
Jul 24, 2003
Appl. No.:
10/626065
Inventors:
Chris Aschoff - Corvallis OR, US
Paul F. Reboa - Corvallis OR, US
Pamela Woody - Corvallis OR, US
Yi Feng - San Diego CA, US
Terry M. Lambright - Corvallis OR, US
Leo Clarke - Albany OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B41J002/05
US Classification:
347 63
Abstract:
Fluid-ejection devices capable of ejecting fluid onto media and methods for their manufacture are provided. One embodiment includes adhering a fluid-ejecting substrate of the fluid-ejection device to a carrier of the fluid-ejection device by drawing an adhesive between the fluid-ejecting substrate and the carrier using capillary action.

Hot-Melt Seal For Nozzles On Print Cartridges And Method

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US Patent:
6959976, Nov 1, 2005
Filed:
Mar 28, 2001
Appl. No.:
09/820427
Inventors:
Veronica A. Nelson - Corvallis OR, US
Melanie J Feder - Blodgett OR, US
Terry M. Lambright - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B41J002/165
US Classification:
347 29
Abstract:
Hot-melt Seal For Nozzles on Print Cartridges And Method. A layer of hot-melt is adhesively bonded to a print cartridge to seal the nozzles through which ink is jetted. In another aspect, a layer of hot-melt seals the electrical contacts and leads mounted on the print cartridge. The hot-melt adhesive can be either laminated with a moisture retardant (preferably impermeable) base film or block coated on moisture retardant (preferably impermeable) pouch material. These materials are thereafter adhesively bonded to the print cartridge, sealing the nozzles and preferably the electrical contacts and leads as well. In one application process, a hot-melt moisture retardant laminate tape is cut to size, releasably captured, positioned over the nozzles, and heat staked to seal the nozzles of the print cartridge. In a second application process, a layer of hot-melt is directly applied over the nozzles and a layer of moisture retardant material is heat staked to the hot-melt. In a third application process, heat stakable pouch material is block coated with hot-melt, the block coated hot-melt is positioned over the nozzles and heat staked, and the print cartridge is thereafter flow wrapped.

Method And A System For Solid Freeform Fabricating Using Non-Reactive Powder

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US Patent:
7120512, Oct 10, 2006
Filed:
Aug 25, 2003
Appl. No.:
10/648122
Inventors:
Laura Kramer - Corvallis OR, US
Vladek P Kasperchik - Corvallis OR, US
Terry M. Lambright - Corvallis OR, US
Melissa D. Boyd - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
G06F 19/00
US Classification:
700119, 700 98, 700118, 700198
Abstract:
A method for creating a three-dimensional solid freeform fabrication object with non-reactive powder includes spreading a non-reactive powder on a substrate, selectively dispensing a reactive resin onto the non-reactive powder forming a mixture of reactive resin and non-reactive powder, wherein the selective dispensing of the reactive resin defines the three-dimensional object, and curing the reactive resin thereby encapsulating the non-reactive powder.

System And Method For Fabricating A Three-Dimensional Metal Object Using Solid Free-Form Fabrication

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US Patent:
7220380, May 22, 2007
Filed:
Oct 14, 2003
Appl. No.:
10/686263
Inventors:
Isaac Farr - Corvallis OR, US
Terry M. Lambright - Corvallis OR, US
Daniel A. Kearl - Philomath OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B22F 7/00
B29C 35/02
US Classification:
419 6, 419 30, 419 36, 419 65, 425130, 4251744
Abstract:
A method for solid free-form fabrication of a three-dimensional metal object includes depositing a particulate blend in a defined region, the particulate blend including a number of metal or metal alloy particulates and a peroxide, and selectively ink-jetting a binder system onto a predetermined area of the particulate blend to form a green part, wherein the liquid phase binder includes a water soluble monofunctional acrylate-based monomer, a water soluble difunctional acrylate-based monomer, an amine, and water.

Calcium Aluminate Cement Compositions For Solid Freeform Fabrication

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US Patent:
7258736, Aug 21, 2007
Filed:
Jun 24, 2003
Appl. No.:
10/603405
Inventors:
Christopher Oriakhi - Corvallis OR, US
Terry M. Lambright - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
C04B 7/32
US Classification:
106692, 106696, 264333, 427427
Abstract:
The present invention is drawn toward materials, methods and systems for solid free-form fabrication of three dimensional objects. In one embodiment, a method can comprise a) applying a particulate blend in a layer, wherein the particulate blend includes calcium aluminate particulates and polymeric binder particulates; b) dispensing an aqueous polyol-containing liquid vehicle onto a predetermined area of the particulate blend to form hydrated cement in the predetermined area; c) hardening the hydrated cement; and d) repeating steps a) through c) such that multiple layers of the cement are formed that are bound to one another, thereby forming the three dimensional object.
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Terry Michael Lambright from Corvallis, OR, age ~73 Get Report