Timothy J Mccormack

7056192, Jun 6, 2006

Sep 14, 2004

10/711369

Rajasekhar Venigalla - Wappingers Falls NY, US
James W. Hannah - Ossining NY, US
Timothy M. McCormack - Poughkeepsie NY, US

International Business Machines Corporation - Armonk NY

B24D 3/00

451 36, 51307

By adding silica to ceria-based CMP slurries the polish process starts much faster than without silica thereby eliminating dead time in the polish process and eliminating process instability caused by changes in the dead time with operating conditions. A slurry for performing chemical mechanical polishing (CMP) of patterned oxides (e. g. , STI, PMD, ILD) on a substrate, comprises: ceria particles having a concentration of 1. 0–5. 0 wt % and silica particles having a concentration of 0. 1–5. 0 wt %. A ratio of ceria concentration to silica concentration (ceria:silica) is from approximately 10:1 to nearly 1:1 by weight. The ceria particles have a particle size of 150–250 nm, and the silica particles have a particle size of greater than 100 nm. The silica may be fumed or colloidal. The slurry has a pH of approximately 9.

8285414, Oct 9, 2012

Mar 31, 2009

12/415348

Ehud Aharoni - Kfar Saba, IL
Robert J. Baseman - Brewster NY, US
Ramona Kei - Hopewell Junction NY, US
Oded Margalit - Ramat Gan, IL
Kevin Mackey - Wappingers Falls NY, US
Michal Rosen-Zvi - Jerusalem, IL
Raminderpal Singh - Cortlandt Manor NY, US
Noam Slonim - Jerusalem, IL
Hong Lin - Yorktown Heights NY, US
Fateh A. Tipu - Wappingers Falls NY, US
Adam D. Ticknor - Poughkeepsie NY, US
Timothy M. McCormack - Pleasant Valley NY, US

International Business Machines Corporation - Armonk NY

G06F 19/00

700175, 409232

A method and system for evaluating a performance of a semiconductor manufacturing tool while manufacturing microelectronic devices are disclosed. At least one report is generated based on executions of at least one statistical test. The report includes at least one heat map having rows that correspond to sensors, columns that correspond to trace data obtained during recipe steps, and cells at the intersection of the rows and the columns. At least one sensor in the tool obtains trace data of a recipe step while manufacturing at least one microelectronic device. A computing device analyzes the obtained trace data to determine a level of operational significance found in the data and assigns a score to the trace data that indicates a level of operational significance. Then, the computing device places the score in a corresponding cell of the heat map. A user uses the cell for evaluating the tool performance.

8594826, Nov 26, 2013

Sep 10, 2012

13/608032

Ehud Aharoni - Kfar Saba, IL
Robert J. Baseman - Brewster NY, US
Ramona Kei - Hopewell Junction NY, US
Oded Margalit - Ramat Gan, IL
Kevin Mackey - Wappingers Falls NY, US
Michal Rosen-Zvi - Jerusalem, IL
Raminderpal Singh - Essex Junction VT, US
Noam Slonim - Jerusalem, IL
Hong Lin - Yorktown Heights NY, US
Fateh A. Tipu - Wappingers Fall NY, US
Adam D. Ticknor - Poughkeepsie NY, US
Timothy M. McCormack - Pleasant Valley NY, US

International Business Machines Corporation - Armonk NY

G06F 19/00

700121, 438 16, 700108

A method, a system and a computer program product suitable for use in a manufacturing environment comprising a multiplicity of nominally identical independent tools. A computing device generates a multi dimensional array of process trace data derived from at least one of the independent tools, wherein, the array includes data representing a first dimension comprising a list of steps in a manufacturing recipe and data representing a second dimension comprising a list of a set of sensors generating measurements from at least one of the independent tools. The computing device conducts an analysis on at least one preselected subset of the multi dimensional array for the purpose of evaluating at least one operating characteristic of at least one of the independent tools. The computing device presents results of the analysis via a set of hierarchically linked and browseable graphics.

20070049184, Mar 1, 2007

Aug 24, 2005

11/161963

Rajasekhar Venigalla - Wappingers Falls, NY, US
Timothy McCormack - Poughkeepsie NY, US
Johannes Groschopf - Wainsdorf, DE

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
ADVANCED MICRO DEVICES, INC. (AMD) - Sunnyvale CA

B24B 29/00

451285000

A retaining ring structure for a chemical mechanical polishing (CMP) apparatus includes a plurality of protrusions formed on a bottom surface of a retaining ring configured for retaining a workpiece to be polished, the protrusions disposed so as to be in contact with a polishing pad during a polishing operation on the workpiece.

20110195640, Aug 11, 2011

Feb 9, 2010

12/702333

Glenn L. Cellier - Hopewell Junction NY, US
Laertis Economikos - Wappingers Falls NY, US
Timothy M. McCormack - Pleasant Valley NY, US
Rajasekhar Venigalla - Hopewell Junction NY, US

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

B24B 1/00
B24B 7/20
B24B 37/00

451 56, 451288

A chemical mechanical polishing (CMP) system includes a rotating polishing table including a platen providing at least two pressure zones having different pressures; a sub-pad positioned on the platen, the sub-pad including a plurality of openings allowing for transmission of the different pressures therethrough; a fixed abrasive pad positioned on the sub-pad; and a pressure-creating system sealingly coupled to the platen for creating a different pressure in the at least two pressure zones, wherein the different pressures create topography on the fixed abrasive pad. A sub-pad and related method are also provided.

20190184892, Jun 20, 2019

Dec 16, 2017

15/844524

Timothy J. McCormack - Clinton Corners NY, US
James D. Miller - Wyckoff NJ, US

B60Q 1/26
A42B 3/04

An apparatus for use by a driver of a vehicle that has turn signals and a brake signal is described. Display circuitry includes lights, and can be supported by the driver while the driver is operating the vehicle. Base circuitry is in wireless communication with the display circuitry, can detect activation of the turn signals and the brake signal, and includes movement sensors. The apparatus can activate the lights in response to activation of the turn signals and the brake signal. In addition, the base circuitry can broadcast an accident alarm in response to detection of movement of the vehicle suggestive of a traffic accident.